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The BC857BTQ-7 is a PNP small signal Bipolar Junction Transistor (BJT) manufactured by Diodes Incorporated. It utilizes epitaxial planar die construction and is housed in an ultra-small SOT-523 surface-mount package. The device is qualified to AEC-Q101 standards for automotive applications and supports PPAP requirements. Key electrical parameters include a collector-emitter breakdown voltage of -45V, a maximum DC collector current of -100mA, and a power dissipation rating of 150mW at 25°C ambient temperature. The transition frequency is specified at 100MHz.
Verify the specific ordering suffix '-7' corresponds to the standard 3,000-unit reel quantity as defined in the manufacturer's documentation. Confirm that the component marking '3W' matches the intended date code and production batch for traceability purposes. Ensure the procurement channel is authorized to guarantee compliance with the stated AEC-Q101 qualification and PPAP capabilities required for automotive-grade components.
Select this component when designing for space-constrained applications requiring a PNP transistor with automotive-grade reliability. The SOT-523 package offers a smaller footprint compared to standard SOT-23 variants while maintaining similar electrical characteristics. Consider the complementary BC847BTQ if an NPN counterpart is needed for push-pull or differential configurations within the same automotive qualification framework.
This part belongs to the BC857 series of PNP small signal transistors produced by Diodes Incorporated. The 'BTQ' designation indicates the specific SOT-523 packaging and automotive qualification status. It serves as the PNP complement to the BC847BTQ NPN transistor, allowing for matched performance in dual-transistor applications. The series is engineered to meet stringent automotive industry standards for durability and consistency.
Direct substitutes include other AEC-Q101 qualified PNP transistors in the SOT-523 package from Diodes Incorporated, such as the BC857BS variant, provided pinout compatibility and thermal resistance specifications are verified against the original design constraints.