BCM56228B0KPBG

BCM56228B0KPBG

  • Description:8GE + 4 1G/2.5G MULTILAYER SWITC
  • Series:*

SKU:f0233b8649fc Category: Brand:

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Product Detailed Parameters

  • Description:8GE + 4 1G/2.5G MULTILAYER SWITC
  • Series:*
  • Mfr:Broadcom Limited
  • Package:Tray
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BCM56228B0KPBG

Overview

The BCM56228B0KPBG is a high-performance Ethernet switch integrated circuit manufactured by Broadcom Limited. It belongs to the Trident II family of switching silicon, designed for core and aggregation layer applications in data centers and service provider networks. The device supports a non-blocking switching fabric with high throughput capabilities, enabling efficient packet processing and forwarding. It features multiple high-speed serial interfaces for connectivity to other network elements, ensuring scalability and reliability in demanding infrastructure environments.

Feature Summary

  • Supports advanced Quality of Service (QoS) mechanisms including traffic classification, policing, and scheduling for prioritized data handling.
  • Integrates comprehensive security features such as Access Control Lists (ACLs) and encryption support for network protection.
  • Enables flexible port configurations and VLAN tagging to accommodate diverse network topologies and segmentation requirements.

Applications

  • Core router and switch platforms in large-scale data center interconnects.
  • Aggregation layer switches in metropolitan area networks (MAN).
  • Service provider edge devices requiring high-density port connectivity.

Procurement Notes

Verify component authenticity through authorized distributors or direct manufacturer channels due to the prevalence of counterfeit semiconductor components. Confirm the specific revision level and packaging type against the official datasheet specifications before integration into production designs. Ensure compliance with relevant environmental regulations such as RoHS directives applicable to the region of deployment.

Selection Notes

Evaluate the required port density and bandwidth needs against the switching capacity of the Trident II architecture. Consider thermal management solutions suitable for the BGA package form factor given the power dissipation characteristics. Assess compatibility with existing system controllers and software stacks that manage the switch ASIC functionality within the target network equipment design.

Part Context

This component is part of Broadcom's Trident II series, which established benchmarks for high-performance switching silicon. It succeeded earlier generations by offering increased port counts and improved energy efficiency per bit forwarded. The BCM56228 variant specifically targets applications requiring robust Layer 2/Layer 3 processing capabilities within compact form factors for enterprise and carrier-grade hardware.

Replacement Considerations

Direct pin-to-pin replacements are generally not available due to proprietary architecture differences. Potential alternatives include subsequent generations from the same vendor or competing high-end switch ASICs from other manufacturers, though these require significant schematic and firmware redesigns.

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