BCM56850TA1KFSBG

Overview

The BCM56850TA1KFSBG is a Broadcom StrataXGS Tomahawk Ethernet switch ASIC designed for high-performance data center and enterprise networking. It supports multi-layer switching with throughput capacities up to 3.2 Tbps, enabling scalable architectures for leaf-spine topologies. The device integrates native 25 Gbps SerDes interfaces, supporting flexible port configurations including 128x25G, 64x50G, or 32x100G Ethernet connections. It features hardware-accelerated processing for overlay tunneling, flow classification, and congestion management, ensuring low latency and high packet forwarding rates essential for modern cloud infrastructure.

Feature Summary

• Hardware-accelerated support for VXLAN, NVGRE, and MPLS tunneling for network virtualization
• Integrated BroadView telemetry for real-time traffic monitoring and congestion detection
• Smart-Buffer technology providing dynamic packet buffering to prevent head-of-line blocking
• Compiler-programmable architecture allowing customizable forwarding and telemetry logic

Applications

• Data Center Top-of-Rack (ToR) switches connecting 25G servers
• Leaf-Spine fabric core switching in large-scale cloud environments
• High-density aggregation switches requiring 100G uplinks
• Storage area networks utilizing RoCEv2 protocols

Procurement Notes

Verify the specific silicon stepping indicated by the suffix 'T' against the official datasheet revision history, as it may denote a specific manufacturing lot or minor engineering change distinct from standard production units. Confirm package availability and moisture sensitivity level handling requirements prior to assembly. Ensure compatibility with the intended Network Operating System (NOS) version supported by this specific silicon variant.

Selection Notes

Select this component when designing systems requiring native 25G connectivity without external retimers. Compare against the BCM56960 series if higher aggregate bandwidth exceeding 3.2 Tbps is required. Evaluate power consumption constraints relative to the 7nm process node benefits. Ensure PCB design capabilities support the high-pin-count FBGA package and impedance-controlled routing for integrated SerDes lanes.

Part Context

This part belongs to the Broadcom StrataXGS Tomahawk family, representing a generation of high-throughput switching silicon optimized for data center scalability. It succeeded earlier generations like the Trident series, offering improved density and energy efficiency. The model integrates advanced match-action pipelines and extensive buffer memory to handle bursty traffic patterns common in modern distributed computing workloads.

Replacement Considerations

Direct pin-to-pin replacements are generally unavailable due to architectural differences. Consider the BCM56960B0KFSBG for higher capacity needs or the BCM56860A1KFSBG for similar feature sets with potential packaging variations. Verify software SDK compatibility before migrating to alternative models within the same product family.