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The BCX55-TP is a medium power NPN bipolar junction transistor manufactured by Micro Commercial Components. It utilizes silicon planar technology and is housed in the SOT-89 surface-mount package, which provides a compact form factor suitable for automated assembly. The device is designed for general-purpose amplification and switching applications within electronic circuits. It features a collector-emitter voltage rating of 80 V and a continuous collector current capacity of 1 A. The component operates within a temperature range from -55 °C to +175 °C and includes an integrated ESD protection diode between the base and emitter terminals.
Verify the specific suffix designation against the manufacturer's official documentation to confirm pinout configuration and internal protection features. Ensure the ordering part number matches the required thermal resistance and package variant. Cross-reference with the latest datasheet revision to validate absolute maximum ratings and thermal characteristics before finalizing procurement specifications.
Select this component when a robust NPN transistor with moderate current handling and integrated base-emitter protection is required. The SOT-89 package offers a balance between thermal dissipation capabilities and footprint size. Consider the 80 V collector-emitter voltage rating and 1 A current limit to ensure adequate headroom for the intended load conditions and operating environment.
The BCX55-TP belongs to the BCX series of medium power NPN transistors produced by Micro Commercial Components. This series is engineered for versatile use in consumer electronics and industrial control systems. The TP suffix typically denotes a tape-and-reel packaging format, facilitating efficient high-volume manufacturing processes while maintaining standard electrical specifications defined by the manufacturer.
Consult official substitution guides for compatible equivalents such as the BCX56 series variants or other SOT-89 packaged NPN transistors with matching voltage and current ratings. Verify pin compatibility and thermal performance metrics before implementing any alternative components in existing designs.