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The BCY59-IX TIN/LEAD is a silicon NPN single bipolar junction transistor manufactured by Central Semiconductor Corp. It utilizes an epitaxial planar process and is housed in a TO-18-3 metal can package for through-hole mounting. The device supports a maximum collector-emitter voltage of 32 V, a continuous collector current of 100 mA, and a power dissipation rating of 340 mW at 25°C ambient temperature. It features a transition frequency of 150 MHz and operates within a junction temperature range of -65°C to +200°C.
Verify component authenticity due to the discontinued status of this part number. Confirm that the tin/lead plating meets specific environmental or regulatory requirements for the intended application. Ensure compatibility with existing through-hole assembly processes and verify that the TO-18-3 package dimensions match the design footprint. Check for available surplus stock from authorized distributors.
Select this component when a ruggedized NPN transistor with a metal case is required for high-temperature environments up to 200°C. Consider its 150 MHz transition frequency for moderate-speed switching or amplification tasks. Evaluate the 340 mW power dissipation limit against thermal management constraints in the final assembly. Compare specifications with other BCY59 variants if lead-free compliance is mandatory.
This component belongs to the BCY59 series of NPN transistors produced by Central Semiconductor Corp. The series includes various suffixes indicating different electrical grades and packaging options. The BCY59-IX variant specifically denotes the tin/lead plated version in a TO-18-3 metal can. These devices are typically used in applications demanding high reliability and radiation hardness characteristics common in military-grade electronics.
Public confirmed substitute part numbers are not available in the provided documentation.