BFP843FH6327XTSA1

Overview

The BFP843FH6327XTSA1 is a SiGe:C NPN RF bipolar transistor in the TSFP-4-1 package. It features a maximum collector-emitter voltage of 2.25 V, a maximum collector current of 55 mA, and total power dissipation of 125 mW. At 900 MHz with IC = 15 mA, it provides a typical maximum power gain (Gma) of 24.5 dB and an output third-order intercept point (OIP3) of 24 dBm. Minimum noise figure (NFmin) is 0.8 dB at 8 mA. The device supports up to 20 dBm RF input power and offers 1.5 kV HBM ESD hardness.

Feature Summary

• Robust low-noise broadband pre-matched RF heterojunction bipolar transistor
• High transition frequency enabling best-in-class noise performance at high frequencies
• Suitable for low voltage applications including 1.2 V and 1.8 V operation

Applications

• WLAN, WiMAX and UWB systems
• Satellite radio (SDARs, DAB)
• Navigation systems (GPS, GLONASS, BeiDou, Galileo)

Procurement Notes

Verify component authenticity through authorized Infineon channels or certified distributors. Request original datasheets and material content sheets to confirm specifications. Ensure proper ESD handling protocols are followed during storage and assembly due to the device's sensitivity. Confirm that the TSFP-4-1 footprint matches your PCB design requirements before finalizing procurement orders.

Selection Notes

Select this component for designs requiring ultra-low noise figures and high linearity in compact form factors. Verify biasing conditions carefully, as the device operates optimally at low voltages like 1.8 V. Consider thermal management constraints given the 125 mW power dissipation limit in the small TSFP-4-1 package. Evaluate impedance matching networks to leverage the pre-matched characteristics for simplified circuit design.

Part Context

This part belongs to the BFP843F family of SiGe:C RF transistors manufactured by Infineon Technologies. It is specifically designed for high-frequency wireless communication applications where low noise and robustness are critical. The FH6327XTSA1 suffix indicates the specific tape-and-reel packaging configuration used for automated surface-mount assembly processes.

Replacement Considerations

Consult official Infineon documentation for qualified substitute parts. Cross-reference electrical parameters such as NFmin, Gma, and OIP3 to ensure compatibility. Verify pinout and package dimensions match the TSFP-4-1 specification before implementing any alternative components in existing designs.