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The BFS 466L6 E6327 is an NPN silicon RF twin transistor in a TSLP-6-1 package. It integrates two distinct transistors: TR1 (BFR460L3 die) and TR2 (BFR360L3 die). Key electrical parameters include VCEO ratings of 4.5V for TR1 and 6V for TR2 at TA > 0°C, with maximum collector currents of 50mA and 35mA respectively. The device features low noise figures of 1.1dB (TR1) and 1.0dB (TR2) at 1.8 GHz, transition frequencies up to 16GHz for TR1, and power gains reaching 17dB at 1.8 GHz.
Verify component authenticity through authorized Infineon channels or certified distributors. Confirm RoHS compliance and Pb-free status via official documentation. Check for specific ordering suffixes that may indicate packaging variations. Ensure handling precautions are followed due to ESD sensitivity. Validate supply chain integrity before integration into production.
Select this component when space-constrained designs require dual RF functions in a minimal footprint. Compare TR1 and TR2 specifications against circuit requirements for gain, noise, and linearity. Ensure operating conditions remain within the specified thermal resistance limits. Consider the TSLP-6-1 package dimensions during PCB layout planning.
This part belongs to the BFS series of RF twin transistors from Infineon Technologies. It utilizes BFR460L3 and BFR360L3 dies within a unified housing. The TSLP-6-1 package represents one of the smallest SMD options available for dual-transistor RF applications.
No direct public substitute part numbers are confirmed in the provided documentation. Designers should evaluate other Infineon twin transistor variants or discrete BFR460/BFR360 combinations if pin compatibility allows.