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BSC010N04LS6ATMA1 is listed in the Single FETs, MOSFETs range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is MOSFET N-CH 40V 40A/100A TDSON. Review the specifications below when checking this part for your BOM.
The BSC010N04LS6 is an OptiMOS™ 6 N-channel power transistor rated for a drain-source voltage of 40 V. It features a maximum on-resistance of 1 mΩ and supports a continuous drain current of 285 A at 25 °C case temperature. The device utilizes a PG-TDSON-8 FL package with enlarged source interconnection to achieve superior thermal resistance, with a junction-to-case value of 1 °C/W. Key dynamic parameters include a total gate charge of 67 nC and an output charge of 73 nC. It is fully qualified according to JEDEC standards for industrial applications and operates within a temperature range of -55 °C to 175 °C.
Verify the specific ordering code matches the required package variant. Confirm that the application environment aligns with the specified industrial qualification standards. Ensure thermal management design accounts for the provided junction-to-case thermal resistance values. Check for any specific handling requirements related to the surface mount technology used in the TDSON-8 FL package.
Select this component when low conduction losses are critical in 40 V systems. The TDSON-8 FL package offers improved thermal performance compared to standard packages. Consider the gate charge specifications for driver compatibility. Evaluate the pulsed drain current capability against peak load requirements in the target circuit design.
This part belongs to Infineon's OptiMOS™ 6 family, designed for low-voltage power switching. It represents a generation focused on reducing on-resistance while maintaining fast switching speeds. The technology targets high-density power conversion solutions where thermal management is a primary constraint.
Cross-reference with other OptiMOS™ 6 devices offering similar RDS(on) and voltage ratings. Verify pinout compatibility if substituting within the same package family. Ensure thermal characteristics meet or exceed the original design requirements.
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