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BSC011N03LSTATMA1 is listed in the Single FETs, MOSFETs range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is MOSFET N-CH 30V 39A/100A TDSON. Review the specifications below when checking this part for your BOM.
The BSC011N03LSTATMA1 is an N-channel power MOSFET from Infineon Technologies, utilizing OptiMOS 5 technology. It features a 30V drain-source voltage rating and a continuous drain current of 39A at case temperature (Ta) or 100A at case temperature (Tc). The device offers a maximum on-resistance of 1.1mΩ at 10V gate drive. Power dissipation capabilities are rated at 3W at ambient temperature and 115W at case temperature. It is housed in a surface-mount PG-TDSON-8 FL package.
Verify the component status before procurement as sources indicate it may be scheduled for obsolescence. Confirm the specific datasheet version matches your design requirements. Ensure compatibility with the PG-TDSON-8 FL footprint during layout. Check for any end-of-life notices from the manufacturer to avoid supply chain disruptions in future production runs.
Select this component when a 30V N-channel MOSFET with low Rds(on) is required. The PG-TDSON-8 FL package suits space-constrained surface-mount designs. Consider the thermal ratings of 3W (Ta) and 115W (Tc) for heat dissipation planning. OptiMOS 5 technology provides efficiency benefits over older generations for modern power conversion needs.
This part belongs to Infineon's OptiMOS family, specifically the OptiMOS 5 generation designed for improved efficiency. It is an N-channel silicon-based power transistor intended for general-purpose power switching. The device is manufactured using standard silicon technology and is available in leadless surface-mount packages for automated assembly processes.
Check for direct substitutes within the OptiMOS 5 series with similar voltage and current ratings. Verify pinout compatibility with the PG-TDSON-8 FL package if replacing with other manufacturers' components. Ensure thermal resistance values match the existing heatsinking or PCB copper area design constraints.
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