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BSC105N10LSFGATMA1 is listed in the Single FETs, MOSFETs range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is MOSFET N-CH 100V 11.4/90A 8TDSON. Review the specifications below when checking this part for your BOM.
The BSC105N10LSFGATMA1 is an N-Channel Power MOSFET from Infineon Technologies, part of the OptiMOS family. It features a maximum drain-source voltage (Vds) of 100 V and a continuous drain current (Id) of 11.4 A at ambient temperature, rising to 90 A at case temperature. The device exhibits a maximum on-resistance (Rds(on)) of 10.5 mΩ at 10 V gate drive. It is housed in a surface-mount PG-TDSON-8 package with a thermal resistance (RthJC) of 1.1 K/W and supports a maximum power dissipation of 156 W at case temperature.
Verify the complete ordering code including the ATMA1 suffix to ensure correct tape-and-reel packaging configuration. Confirm RoHS compliance status through official Infineon documentation prior to integration. Cross-reference the specific datasheet version to validate electrical parameters against your system requirements.
Select this component for applications requiring 100 V blocking voltage with moderate current handling capabilities. The PG-TDSON-8 package offers a compact footprint suitable for space-constrained designs. Evaluate thermal management strategies based on the specified RthJC value to maintain junction temperatures within safe operating limits during continuous operation.
This part belongs to the Infineon OptiMOS power transistor series, designed for general-purpose switching applications. The OptiMOS portfolio emphasizes low conduction losses and improved thermal characteristics compared to standard MOSFETs. The BSC105N10LSFGATMA1 represents a specific variant optimized for surface-mount assembly in industrial and consumer electronics.
Check for direct substitutes such as BSC105N10LSF or other OptiMOS devices with identical pinout and similar electrical ratings. Ensure any replacement matches the PG-TDSON-8 package dimensions and thermal properties to avoid PCB redesign.
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