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The BSC150N03LDGATMA1 is a dual N-channel logic-level power MOSFET from Infineon's OptiMOS™ 3 series, housed in a PG-TDSON-8 package. It features a drain-source breakdown voltage of 30 V and a continuous drain current of 20 A at 25 °C case temperature. The maximum on-resistance (RDS(on)) is 15 mΩ at VGS=10 V and 22 mΩ at VGS=4.5 V. Total gate charge is typically 6.4 nC at VGS=10 V. Thermal resistance from junction to case is 4.9 K/W via the bottom pad. Operating and storage temperatures range from -55 °C to +150 °C.
Verify the component against the official Infineon datasheet revision 1.4 to confirm electrical parameters and package dimensions. Ensure the ordering suffix matches the required reel quantity and tape-and-reel specifications. Confirm RoHS compliance and halogen-free status as per IEC61249-2-21 requirements before finalizing procurement orders.
Select this component for designs requiring low on-resistance and fast switching in compact spaces. The dual-channel architecture supports efficient synchronous rectifier topologies. Evaluate thermal management needs based on the specified junction-to-case resistance. Verify that the logic-level gate drive compatibility aligns with the controller's output voltage levels for optimal performance.
This part belongs to the OptiMOS™ 3 family of power transistors, which are silicon-based N-channel devices. The series is characterized by excellent gate charge versus on-resistance product figures of merit. These components are engineered to provide high efficiency and reliability in power conversion circuits.
Direct replacements must match the PG-TDSON-8 footprint and dual N-channel configuration. Verify that substitute parts meet or exceed the 30 V breakdown voltage and 20 A current ratings. Check thermal resistance values to ensure equivalent heat dissipation capabilities.
Yes, the device is qualified with 100% avalanche testing.
The maximum operating and storage temperature range is -55 °C to +150 °C.
Yes, the PG-TDSON-8 package includes a thermal pad for bottom-side cooling with a junction-to-case thermal resistance of 4.9 K/W.