BSM15GD120DN2BOSA1

BSM15GD120DN2BOSA1

  • Description:IGBT MOD 1200V 25A 145W
  • Series:-

SKU:a52c757906dd Category: Brand:

ChipApex WhatsApp

Consult the customer manager about the wholesale price.

consultation hotline:86-132-6715-2157

email:[email protected]
Contact the product manager for consultation. One-stop consultation is available.


Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.

Submitting!
Submission successful!
Submission failed!
Email error!
Phone number error!

Product Detailed Parameters

  • Description:IGBT MOD 1200V 25A 145W
  • Series:-
  • Mfr:Infineon Technologies
  • Package:Tray
  • IGBT Type:-
  • Configuration:Three Phase Inverter
  • Vce(on) (Max) @ Vge, Ic:3V @ 15V, 15A
  • Input:Standard
  • NTC Thermistor:No
  • Operating Temperature:150°C (TJ)
  • Mounting Type:Chassis Mount
  • Package / Case:Module
  • Supplier Device Package:Module
  • Voltage - Collector Emitter Breakdown (Max):1200 V
  • Current - Collector (Ic) (Max):25 A
  • Power - Max:145 W
  • Current - Collector Cutoff (Max):500 µA
  • Input Capacitance (Cies) @ Vce:100 pF @ 25 V

Download product information

BSM15GD120DN2BOSA1

Overview

The BSM15GD120DN2BOSA1 is a single IGBT module from Infineon's EconoDUAL™ 3 family. It features an N-channel Insulated Gate Bipolar Transistor with an anti-parallel Fast Recovery Freewheeling Diode (FRD). The device has a collector-emitter breakdown voltage of 1200 V and a nominal collector current of 15 A at 25°C case temperature. Key electrical parameters include a maximum DC collector current of 30 A, a typical saturation voltage of 1.75 V at 15 A, and a reverse recovery charge of 48 nC for the diode. The module utilizes copper-clad direct bond copper (DBC) substrate technology for enhanced thermal performance.

Feature Summary

  • EconoDUAL™ 3 packaging provides high power density and low parasitic inductance through optimized internal busbar design.
  • Integrated fast recovery freewheeling diode enables efficient commutation and reduced switching losses.
  • Direct Bond Copper (DBC) substrate ensures robust thermal cycling capability and reliable heat dissipation.

Applications

  • Motor drives and servo amplifiers
  • Uninterruptible Power Supplies (UPS)
  • Induction heating systems

Procurement Notes

Verify the specific suffix BOSA1 against the manufacturer's official datasheet to confirm pinout compatibility and terminal plating specifications. Ensure that the ordering part number matches the exact revision required for your application, as minor manufacturing updates may affect mechanical dimensions or material composition without changing the base model designation.

Selection Notes

Select this component for applications requiring compact form factors with moderate current ratings up to 15 A. Evaluate the thermal resistance characteristics against your system's cooling strategy, as the EconoDUAL™ 3 package relies on effective heatsinking to maintain junction temperatures within safe operating limits during continuous operation.

Part Context

This module belongs to Infineon's EconoDUAL™ 3 series, designed for high-power density industrial applications. It succeeds previous generations by offering improved thermal performance and lower stray inductance, making it suitable for modern high-frequency switching requirements in power electronics systems.

Replacement Considerations

Cross-reference with other Infineon modules in the same current and voltage class, such as the BSM15GD120DN2, ensuring mechanical footprint and pin configuration compatibility before substitution.

BSM15GD120DN2BOSA1BSM15GD120DN2BOSA1

Click on the inquiry