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Product Detailed Parameters
- Description：IGBT MOD 1200V 420A 1550W
- Series：-
- Mfr：Infineon Technologies
- Package：Tray
- IGBT Type：-
- Configuration：Half Bridge
- Vce(on) (Max) @ Vge, Ic：2.6V @ 15V, 200A
- Input：Standard
- NTC Thermistor：No
- Operating Temperature：-40°C ~ 125°C
- Mounting Type：Chassis Mount
- Package / Case：Module
- Supplier Device Package：Module
- Voltage - Collector Emitter Breakdown (Max)：1200 V
- Current - Collector (Ic) (Max)：420 A
- Power - Max：1550 W
- Current - Collector Cutoff (Max)：5 mA
- Input Capacitance (Cies) @ Vce：13 nF @ 25 V
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Overview
The BSM200GB120DLCHOSA1 is a dual IGBT module from Infineon Technologies, rated for 1200 V collector-emitter voltage and 200 A continuous collector current. It features an integrated anti-parallel diode in a half-bridge configuration within a flange-mount package. The component utilizes TrenchStop technology to optimize switching performance and conduction losses. Designed for industrial applications, it supports a maximum junction temperature of 150°C and includes an NTC thermistor for thermal monitoring.
Feature Summary
- Integrates two series-connected IGBT elements with built-in diodes in a single compact module.
- Incorporates TrenchStop technology to enhance switching efficiency and reduce power losses.
- Features an isolated case connection for secure mounting and electrical safety.
- Includes an integrated NTC thermistor for precise real-time temperature monitoring.
Applications
- Industrial motor drives and servo systems
- Uninterruptible power supplies (UPS)
- Induction heating equipment
Procurement Notes
Verify the complete part number including the HOSA1 suffix against official Infineon documentation to ensure correct pinout and specification alignment. Confirm RoHS compliance status and lead times through authorized distributors. Request the latest datasheet to validate thermal characteristics and gate drive requirements before finalizing procurement orders.
Selection Notes
Select this module for high-power applications requiring robust current handling and reliable thermal management. Ensure the cooling system can maintain the junction temperature below 150°C under peak load conditions. Verify that the gate drive circuit provides appropriate voltage levels and current capabilities for the specific IGBT variant.
Part Context
This component belongs to the EconoPACK family of IGBT modules, known for their compact design and high power density. The BSM series represents a standard offering for general-purpose industrial power conversion, balancing performance with cost-effectiveness. It serves as a core switching element in various AC/DC and DC/AC conversion topologies.
Replacement Considerations
Direct replacements must match the 1200V/200A rating and EconoPACK form factor. Consider variants like BSM150GB120DLC for lower current needs or BSM300GB120DLC for higher capacity, ensuring pin compatibility and thermal interface alignment.
FAQ
What is the maximum operating junction temperature?
The maximum operating junction temperature is 150°C.
Does the module include an integrated temperature sensor?
Yes, the module includes an integrated NTC thermistor for thermal monitoring.
What packaging style does this module use?
It uses a flange-mount package designed for direct heatsink attachment.
