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Product Detailed Parameters
- Description：IGBT LP ECONO AG-ECONO2A-211
- Series：*
- Mfr：Infineon Technologies
- Package：Tray
- IGBT Type：-
- Configuration：-
- Vce(on) (Max) @ Vge, Ic：-
- Input：-
- NTC Thermistor：-
- Operating Temperature：-
- Mounting Type：-
- Package / Case：-
- Supplier Device Package：-
- Voltage - Collector Emitter Breakdown (Max)：-
- Current - Collector (Ic) (Max)：-
- Power - Max：-
- Current - Collector Cutoff (Max)：-
- Input Capacitance (Cies) @ Vce：-
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Overview
The BSM25GP120B2BPSA1 is a Power Integrated Module (PIM) manufactured by Infineon Technologies, utilizing silicon IGBT technology. It features a full bridge configuration housed in an EconoPIM3 package with screw mount installation. The module supports a collector-emitter maximum voltage of 1.2 kV and delivers a continuous collector current of 25 A at 25°C. Key electrical parameters include a collector-emitter saturation voltage of 2.5 V, a gate-emitter leakage current of 300 nA, and a power dissipation rating of 230 W. The device operates within a temperature range of -40°C to +125°C, with a maximum gate-emitter voltage of 20 V.
Feature Summary
- Integrates a full bridge topology within a compact EconoPIM3 housing for efficient space utilization.
- Utilizes silicon IGBT technology optimized for high-voltage switching applications.
- Designed for robust thermal management with specified power dissipation capabilities.
Applications
- Industrial motor drives
- Uninterruptible power supplies
- Welding equipment
Procurement Notes
Verify the specific suffix 'B2' against official datasheets to confirm pinout or parameter variations compared to standard versions. Confirm end-of-life status and availability through authorized distributors, as supply constraints may apply to discontinued or revised part numbers.
Selection Notes
Select this module for applications requiring a 1.2 kV full bridge configuration with 25 A continuous current capability. Ensure the cooling solution accommodates the 230 W power dissipation rating and that the operating environment remains within the specified -40°C to +125°C temperature range.
Part Context
This component belongs to Infineon's BSM series of Power Integrated Modules, designed for industrial power conversion. The EconoPIM3 package provides a standardized form factor for easy integration into existing designs requiring high-power density solutions.
Replacement Considerations
Check for updated revisions such as BSM25GP120BOSA1. Verify pin compatibility and electrical specifications before substituting with other PIMs from the same family.
