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The BSM25GP120BPSA1 is a Power Integrated Module (PIM) manufactured by Infineon Technologies, designed for high-power switching applications. It features a Full Bridge configuration and utilizes Silicon IGBT technology. The module supports a maximum collector-emitter voltage of 1.2 kV and provides a continuous collector current of 25 A at 25°C. Key electrical parameters include a collector-emitter saturation voltage of 2.5 V and a power dissipation capacity of 360 W. It operates within a temperature range of -40°C to +125°C and is housed in an EconoPIM2 package with screw mount installation.
Verify the specific suffix 'BPSA1' against official Infineon documentation to confirm exact ordering details, as datasheets may list base part numbers like BSM25GP120. Confirm availability status directly with authorized distributors, as this component type may be subject to end-of-life notices or limited stock constraints depending on the manufacturing batch date code.
Select this module when a full bridge configuration is required within a single package to save board space. Ensure the cooling solution can handle the specified 360 W power dissipation. Verify that the system voltage does not exceed the 1.2 kV rating and that the gate drive circuitry aligns with the standard IGBT requirements for this family.
This component belongs to Infineon's EconoPIM series, which integrates diodes and IGBTs into a single module. The BSM25GP120 variant specifically offers 25 A current handling capability. The 'BPSA1' suffix typically denotes automotive-grade qualification or specific tape-and-reel/tray packaging variations defined by Infineon's internal coding standards.
Direct pin-compatible replacements are limited due to the specific PIM configuration. Consider the BSM25GP120 as the base model identifier. For upgrades, evaluate newer EconoPIM generations if available, but verify thermal resistance and pinout compatibility carefully before substitution.