BSM300GA170DLS

Overview

The BSM300GA170DLS is a single IGBT module from Infineon Technologies, designed for high-power industrial applications. It features a nominal collector-emitter voltage (Vceo) of 1700 V and a continuous collector current (Ic) of 600 A at 25°C. The module utilizes silicon technology and employs a dual emitter configuration to enhance thermal performance and switching characteristics. With a maximum gate-emitter voltage of 20 V, it ensures robust operation within standard drive limits. The component is rated for a chassis mount installation style, facilitating integration into larger power conversion systems.

Feature Summary

• Single IGBT configuration with dual emitter architecture
• High voltage rating of 1700 V for demanding power environments
• Robust current handling capability of 600 A continuous collector current
• Chassis mount design for efficient thermal management

Applications

• Industrial motor drives
• Uninterruptible power supplies (UPS)
• Induction heating systems

Procurement Notes

Verify the specific ordering suffix and revision level against the official Infineon datasheet to ensure compatibility with existing system designs. Confirm that the chassis mounting interface matches the mechanical constraints of the target application. Check for any regional distribution restrictions or supply limitations that may affect procurement timelines. Ensure that storage and handling conditions adhere to moisture sensitivity levels specified in the package documentation to maintain device integrity prior to assembly.

Selection Notes

Select this module when high voltage blocking capability and substantial current handling are required in a single-phase or half-bridge topology. Consider the thermal resistance characteristics and the need for chassis cooling solutions. Evaluate the switching speed requirements against the 1700 V rating to ensure efficiency meets system goals. Verify that the gate drive circuitry can support the 20 V maximum limit without exceeding safe operating areas during transient conditions.

Part Context

This component belongs to Infineon's GA series of IGBT modules, which are engineered for medium to high-power applications. The series emphasizes reliability and thermal performance through advanced packaging technologies. The BSM300GA170DLS represents a specific variant optimized for 1700 V operations, fitting into the broader portfolio of silicon-based power modules designed for industrial and traction markets.

Replacement Considerations

No public confirmed substitute part numbers are available in the provided documentation. Cross-referencing requires consulting official replacement guides or technical support channels.