BSM30GP60BOSA1

BSM30GP60BOSA1

  • Description:IGBT MODULE 600V 50A 180W
  • Series:-

SKU:5f0301c8d1f5 Category: Brand:

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Product Detailed Parameters

  • Description:IGBT MODULE 600V 50A 180W
  • Series:-
  • Mfr:Infineon Technologies
  • Package:Tray
  • IGBT Type:-
  • Configuration:Full Bridge
  • Vce(on) (Max) @ Vge, Ic:2.45V @ 15V, 30A
  • Input:Three Phase Bridge Rectifier
  • NTC Thermistor:Yes
  • Operating Temperature:-40°C ~ 125°C
  • Mounting Type:Chassis Mount
  • Package / Case:Module
  • Supplier Device Package:Module
  • Voltage - Collector Emitter Breakdown (Max):600 V
  • Current - Collector (Ic) (Max):50 A
  • Power - Max:180 W
  • Current - Collector Cutoff (Max):300 nA
  • Input Capacitance (Cies) @ Vce:1.6 nF @ 25 V

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BSM30GP60BOSA1

Overview

The BSM30GP60BOSA1 is a three-phase inverter IGBT module manufactured by Infineon Technologies. It features a collector-emitter breakdown voltage of 600 V and a maximum collector current of 50 A. The device operates within a junction temperature range of -40°C to +125°C and has a maximum power dissipation of 130 W. It utilizes an isolated flange mount package with 24 terminals, designed for robust thermal management in industrial applications.

Feature Summary

  • Three-phase inverter topology integrating multiple switching elements
  • Isolated flange mount construction for efficient heat transfer
  • Integrated NTC thermistor for precise temperature monitoring

Applications

  • Industrial motor drives
  • Uninterruptible power supplies (UPS)
  • Induction heating systems

Procurement Notes

Verify the specific ordering suffix BOSA1 against official Infineon documentation to confirm manufacturing details and compliance status. Ensure compatibility with existing cooling infrastructure due to the flange mount requirement. Cross-reference the part number with authorized distributors to avoid counterfeit components.

Selection Notes

Select this module for applications requiring a 600V rating and up to 50A continuous current. Consider the 130W power dissipation limit when designing the thermal management system. Verify that the control circuitry supports the required gate drive voltages for reliable switching performance.

Part Context

This component belongs to the BSM series of insulated gate bipolar transistor modules from Infineon. These modules are engineered for high reliability and efficiency in power conversion systems. The GP designation typically indicates specific chip technology optimized for general purpose industrial use.

Replacement Considerations

Direct replacements include BSM30GP60 and BSM30GP60 DL. Verify pinout compatibility and thermal characteristics before substitution. Consult Infineon's official cross-reference guides for approved alternatives.

BSM30GP60BOSA1BSM30GP60BOSA1

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