BSM50GP120BOSA1

$278.61

Description：IGBT MODULE 1200V 50A
Series：-

SKU:f60daa1d0bc0 Category: IGBT Modules Brand: Infineon Technologies

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Product introduction

Product Detailed Parameters

Description：IGBT MODULE 1200V 50A
Series：-
Mfr：Infineon Technologies
Package：Tray
IGBT Type：-
Configuration：3 Phase Inverter
Vce(on) (Max) @ Vge, Ic：2.55V @ 15V, 50A
Input：Three Phase Bridge Rectifier
NTC Thermistor：Yes
Operating Temperature：-40°C ~ 125°C
Mounting Type：Chassis Mount
Package / Case：Module
Supplier Device Package：Module
Voltage - Collector Emitter Breakdown (Max)：1200 V
Current - Collector (Ic) (Max)：80 A
Power - Max：-
Current - Collector Cutoff (Max)：500 µA
Input Capacitance (Cies) @ Vce：3.3 pF @ 25 V

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BSM50GP120BOSA1

Overview

The BSM50GP120BOSA1 is a Power Integrated Module (PIM) manufactured by Infineon Technologies, integrating IGBTs and diodes for power conversion. It features a rectifier diode with a repetitive peak reverse voltage of 1600 V and an inverter transistor collector-emitter voltage of 1200 V. The module supports a nominal DC collector current of 50 A at Tc=80°C and a total power dissipation of 360 W at Tc=25°C. It includes a brake-chopper circuit rated for 25 A nominal current. Key electrical parameters include a saturation voltage of 2.55 V max at 25°C and a gate-emitter peak voltage of ±20 V.

Feature Summary

Integrates rectifier, inverter, and brake-chopper circuits within a single package
Includes integrated NTC thermistor for thermal monitoring
Features internal Al2O3 insulation with a CTI of 225

Applications

Industrial motor drives
Uninterruptible power supplies
Welding equipment

Procurement Notes

Verify the component against official datasheets to confirm authenticity and technical specifications. Check for end-of-life status or obsolescence notices from the manufacturer before procurement. Ensure compatibility with existing cooling systems and mounting hardware. Validate that the specific ordering suffix matches the required electrical characteristics.

Selection Notes

Select this module based on the required voltage ratings and current handling capabilities for the target application. Consider the thermal resistance values and maximum junction temperature limits when designing the heatsink interface. Evaluate the switching losses and short-circuit withstand time to ensure protection circuitry is appropriately sized. Verify the mechanical dimensions and mounting torque requirements for the installation.

Part Context

This component belongs to the BSM series of Power Integrated Modules from Infineon Technologies. These modules are designed for high-power applications requiring compact integration of multiple semiconductor functions. The EconoPIM packaging provides a standardized form factor for industrial power electronics.