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The BSM50GX120DN2BOSA1 is a Power Integrations Module (PIM) IGBT module manufactured by Infineon Technologies. It features a full bridge configuration with a collector-emitter maximum voltage of 1.2 kV and a continuous collector current of 50 A at 25°C. The device utilizes EconoPIM3 packaging for screw mounting, operates within a temperature range of -40°C to +125°C, and has a power dissipation rating of 360 W.
Verify the specific ordering suffix against official documentation to confirm exact electrical characteristics and pinout compatibility. Confirm availability status as this component may be subject to end-of-life restrictions or limited supply conditions in certain regions.
Select based on the required 1200 V blocking voltage and 50 A current handling capability. Ensure the thermal management solution supports the specified 360 W power dissipation within the operating temperature limits. Verify that the system layout accommodates the EconoPIM3 form factor and screw mounting requirements.
This part belongs to the Infineon BSM series of IGBT modules, designed for high-power applications requiring robust switching performance. The BSM50GP120 variant shares similar electrical ratings but may differ in specific internal configurations or packaging details.
BSM50GP120 is a confirmed substitute part number listed under aliases for this component family.