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BSP129H6327XTSA1 is listed in the Single FETs, MOSFETs range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is MOSFET N-CH 240V 350MA SOT223-4. Review the specifications below when checking this part for your BOM.
The BSP129H6327XTSA1 is an N-channel depletion mode MOSFET from the Infineon SIPMOS series, housed in a PG-SOT223 package. It features a drain-source breakdown voltage of 240 V and a maximum on-state resistance of 6 Ω at VGS=10V. The device supports a continuous drain current of 0.35 A and power dissipation of 1.8 W. It includes dv/dt rating capabilities up to 6 kV/µs and operates within a temperature range of -55 °C to 150 °C.
Verify the specific threshold voltage band required for your design, as the component is supplied sorted by VGS(th) ranges. Confirm that the PG-SOT223 package dimensions align with your PCB footprint requirements. Ensure the depletion mode characteristic matches your circuit logic, as this device remains conductive at zero gate-source voltage.
Select this component when a normally-on behavior is necessary for the application architecture. The high breakdown voltage allows use in higher voltage systems compared to standard small-signal transistors. Consider the thermal resistance characteristics if operating near the upper temperature limits or requiring efficient heat dissipation through the soldering point.
This part belongs to the Infineon SIPMOS family of small-signal transistors. These devices are engineered for robust performance in compact form factors. The H6327 suffix indicates a specific tape and reel packaging configuration containing 1000 pieces per reel, designed for automated surface-mount assembly processes.
Direct replacements must match the N-channel depletion mode specification and PG-SOT223 package. Verify that substitute components meet the 240 V breakdown voltage and similar thermal resistance values to ensure circuit compatibility without redesign.
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