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BSP130,115 is listed in the Single FETs, MOSFETs range at ChipApex. The manufacturer field lists Nexperia USA Inc.. Its product description is MOSFET N-CH 300V 350MA SOT223. Review the specifications below when checking this part for your BOM.
The BSP130,115 is an N-channel enhancement mode vertical D-MOS transistor manufactured by Nexperia. It operates with a drain-source voltage of 300 V and a continuous drain current of 350 mA. The device features a maximum on-state resistance of 6 Ω at 250 mA and 10 V gate drive. Thermal performance includes a junction-to-ambient resistance of 83.3 K/W and a total power dissipation of 1.5 W at 25 °C ambient temperature.
Verify the specific ordering suffix to confirm package type and tape/reel specifications. Confirm RoHS compliance status for the exact part number variant. Ensure the component meets the required thermal management standards for the intended PCB layout. Check for any recent datasheet supersessions or obsolescence notices before finalizing procurement.
Select this component for applications requiring high-voltage isolation with low-current switching capabilities. The SOT223 package provides adequate heat dissipation for moderate power levels. Consider the threshold voltage range when designing the gate drive circuitry to ensure reliable turn-on across varying temperatures.
This discrete semiconductor belongs to the vertical D-MOS transistor family designed for general-purpose switching. It serves as a robust alternative to standard MOSFETs in high-voltage, low-current scenarios. The technology supports direct logic interfacing, simplifying driver circuit design for industrial and telecommunications equipment.
Check for equivalent N-channel D-MOS transistors with similar 300 V ratings and SOT223 packaging. Verify that substitute parts meet the same thermal resistance and switching speed requirements. Ensure pinout compatibility to avoid redesigning the printed circuit board layout during replacement.
The BSP130 supports a maximum DC drain-source voltage of 300 V.
No, the vertical D-MOS structure eliminates the risk of secondary breakdown.
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