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BSS138 is listed in the Single FETs, MOSFETs range at ChipApex. The manufacturer field lists Shenzhen Slkormicro Semicon Co., Ltd.. Its product description is 50V 220MA 3.5@10V,220MA 225MW N. Review the specifications below when checking this part for your BOM.
The BSS138 is an N-channel enhancement-mode MOSFET manufactured by Shenzhen Slkormicro Semicon Co., Ltd. It features a maximum drain-source voltage (V_DSS) of 50 V and a continuous drain current (I_D) of 220 mA at 25°C. The device has a maximum gate-source voltage (V_GS) of ±20 V and a total power dissipation (P_D) of 225 mW at 25°C, derating by 1.8 mW/°C above this temperature. The junction temperature range is -55°C to +150°C. Electrical characteristics include a gate threshold voltage (V_GS(th)) of up to 1.6 V at I_D = 1 mA, a static drain-source on-state resistance (R_DS(on)) of 3.5 Ω at V_GS = 10 V and I_D = 220 mA, and an input capacitance (C_iss) of 50 pF at V_DS = 25 V.
Verify the manufacturer designation as Shenzhen Slkormicro Semicon Co., Ltd. when sourcing components. Confirm that the part number matches the specific electrical ratings provided in the datasheet, particularly the 220 mA continuous drain current limit. Ensure the package type corresponds to the SOT-23 outline dimensions listed in the documentation before finalizing procurement orders.
Select this component for applications requiring low-voltage switching with minimal footprint. The 50 V breakdown voltage and 220 mA current rating define its operational limits. Consider the 3.5 Ω on-resistance at 10 V gate drive when calculating conduction losses. The SOT-23 package suitability depends on available board space and thermal management requirements within the target design.
This component belongs to the discrete semiconductor category, specifically functioning as a single N-channel MOSFET. It is designed for surface-mount technology (SMT) assembly using the standard SOT-23 form factor. The device utilizes silicon-based MOS technology to provide efficient electronic switching and amplification capabilities for low-power analog and digital systems.
Cross-reference with other manufacturers' BSS138 equivalents if supply constraints exist. Verify that substitute parts maintain identical pinout configurations and meet or exceed the 50 V V_DSS and 220 mA I_D specifications. Ensure thermal resistance and package dimensions are compatible with existing PCB layouts.
The maximum gate-source voltage (V_GS) is rated at ±20 V.
The total device dissipation is 225 mW at 25°C ambient temperature and must be derated by 1.8 mW per degree Celsius above 25°C.
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