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The BSZ146N10LS5ATMA1 is a single N-channel power MOSFET from Infineon’s OptiMOS 5 family, designed for high-efficiency switching applications. It features a maximum drain-source voltage (Vds) of 100 V and a continuous drain current (Id) of 40 A at case temperature. The device exhibits a low on-resistance (Rds(on)) of 14.6 mΩ, enabling reduced conduction losses. Packaged in an 8-pin PG-TSDSON-FL surface-mount footprint, it supports operation within a junction temperature range of -55°C to +175°C. Key electrical characteristics include a gate charge (Qg) of 23 nC and threshold voltage (Vgs(th)) of 2.3 V, optimized for fast switching performance.
Verify the complete part number including suffixes against official Infineon documentation to ensure correct packaging and tape-and-reel specifications. Confirm RoHS compliance status and REACH SVHC declarations prior to integration. Cross-reference datasheet revisions to validate parameter consistency. Ensure ordering quantities align with manufacturer minimums and standard reel sizes.
Select this component when a 100 V N-channel MOSFET with low Rds(on) and compact SMD packaging is required. Consider the 40 A current rating and 14.6 mΩ resistance for efficiency-critical designs. Evaluate thermal dissipation requirements based on the TSDSON-8 package and intended operating environment. Compare gate charge values against driver capabilities for optimal switching speed.
This device belongs to Infineon’s OptiMOS 5 series, which focuses on improving power conversion efficiency in automotive and industrial applications. The BSZ146N10LS5 variant specifically targets 100 V systems requiring moderate current handling in space-constrained PCB layouts. It complements other members of the BSC and BSZ families by offering a balance between conductivity and switching speed.
Direct substitutes may include other OptiMOS 5 devices with similar voltage and current ratings, such as BSZ065N06LS5 or BSC096N10LS5, provided pin compatibility and electrical parameters meet design requirements. Verify package dimensions and thermal pad configurations before substitution.