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Product Detailed Parameters
- Description:IC BUFFER 1 CIRC DDPAK/TO263-5
- Series:-
- Mfr:Texas Instruments
- Package:Tube
- Amplifier Type:Buffer
- Number of Circuits:1
- Output Type:-
- Slew Rate:2000V/µs
- Gain Bandwidth Product:-
- Current - Input Bias:5 µA
- Voltage - Input Offset:30 mV
- Current - Supply:15mA
- Current - Output / Channel:250 mA
- Voltage - Supply Span (Min):4.5 V
- Voltage - Supply Span (Max):36 V
- Operating Temperature:-40°C ~ 85°C
- Grade:-
- Qualification:-
- Mounting Type:Surface Mount
- Package / Case:TO-263-6, D2PAK (5 Leads + Tab), TO-263BA
- Supplier Device Package:TO-263 (DDPAK-5)
- -3db Bandwidth:180 MHz
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Overview
The BUF634F is a high-speed buffer amplifier manufactured by Texas Instruments, designed for demanding video and signal processing applications. It features a single circuit configuration housed in a TO-263 (DDPAK-5) surface-mount package. The device delivers a maximum output current of 250 mA per channel with a supply current consumption of 15 mA. Key electrical specifications include a slew rate of 2000 V/µs and a -3 dB bandwidth of 180 MHz. It operates within a voltage span ranging from 4.5 V to 36 V and maintains an input bias current of 5 µA with an input offset voltage of 30 mV. The component supports an operating temperature range from -40°C to 85°C.
Feature Summary
- Provides high-current drive capability suitable for demanding load conditions
- Offers wide bandwidth performance for high-frequency signal integrity
- Features low power consumption relative to its output drive capacity
Applications
- Video signal buffering and distribution
- High-speed data line termination
- Driving capacitive loads in precision circuits
Procurement Notes
Verify the specific suffix 'F' against the manufacturer's official datasheet to confirm the exact package variant and tape-and-reel specifications. Ensure the ordering part number matches the required TO-263 pinout and thermal pad configuration. Cross-reference the RoHS status and moisture sensitivity level with current production notices before finalizing procurement orders.
Selection Notes
Select this component when a single-channel buffer requires significant current drive without sacrificing high-frequency response. Compare the 180 MHz bandwidth and 250 mA output against alternative packages like the SOIC or DIP variants if board space constraints differ. Consider the thermal dissipation requirements inherent to the DDPAK-5 package for continuous operation at maximum load currents.
Part Context
This part belongs to the BUF634 family of high-speed buffers known for combining high output current with fast transient response. The F suffix typically denotes a specific surface-mount packaging option within the broader product line, which also includes through-hole and smaller footprint versions. This family is engineered to maintain signal fidelity while driving heavy loads in professional audio and video equipment.
Replacement Considerations
Public confirmed substitute part numbers: BUF634AIDR, BUF634PG4.
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