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Product Detailed Parameters
- Description：MOSFET N-CH 60V 2.7A/7.4A 6DFN
- Series：-
- Mfr：Nexperia USA Inc.
- Package：Tape & Reel (TR),Cut Tape (CT)
- FET Type：N-Channel
- Technology：MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss)：60 V
- Current - Continuous Drain (Id) @ 25°C：2.7A (Ta), 7.4A (Tc)
- Drive Voltage (Max Rds On, Min Rds On)：4.5V, 10V
- Rds On (Max) @ Id, Vgs：125mOhm @ 2.7A, 10V
- Vgs(th) (Max) @ Id：2.7V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs：6 nC @ 10 V
- Vgs (Max)：±20V
- Input Capacitance (Ciss) (Max) @ Vds：196 pF @ 30 V
- FET Feature：-
- Power Dissipation (Max)：2W (Ta), 15W (Tc)
- Operating Temperature：-55°C ~ 175°C (TJ)
- Grade：Automotive
- Qualification：AEC-Q101
- Mounting Type：Surface Mount
- Supplier Device Package：DFN2020MD-6
- Package / Case：6-UDFN Exposed Pad
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Overview
The Nexperia BUK6D125-60EX is an N-channel enhancement mode MOSFET utilizing Trench technology in a DFN2020MD-6 (SOT1220) package. It features a drain-source voltage of 60 V, continuous drain current of 7.4 A at 25 °C, and on-state resistance of 92 mΩ typ. The device supports junction temperatures up to 175 °C, offers ESD protection exceeding 2 kV HBM, and includes side wettable flanks for optical inspection.
Feature Summary
- Trench MOSFET technology for optimized performance
- Extended operating temperature range up to 175 °C
- Side wettable flanks enabling optical solder joint inspection
- AEC-Q101 qualified for automotive reliability
Applications
- LED lighting
- High-speed line driver
- Low-side load switch
- Switching circuits
Procurement Notes
Verify the specific ordering suffix against the manufacturer's official documentation to confirm packaging details. Confirm that the component meets all required environmental standards and RoHS compliance specifications before finalizing procurement orders.
Selection Notes
Select this component when a compact SMD solution with high thermal tolerance is required. The low on-resistance and fast switching characteristics make it suitable for efficient power management applications requiring robust avalanche ruggedness and extended temperature operation.
Part Context
This part belongs to Nexperia's medium-power DFN series designed for surface-mount assembly. The leadless plastic package provides enhanced thermal dissipation capabilities compared to traditional small outline packages, supporting higher power densities in space-constrained designs.
Replacement Considerations
Consult the official Nexperia cross-reference guide for verified substitutes. Ensure any replacement maintains identical pinout configuration, voltage ratings, and package dimensions to guarantee mechanical and electrical compatibility.
