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The BUK7M15-60EX is a standard level N-channel MOSFET utilizing TrenchMOS technology, housed in an LFPAK33 (SOT1210) surface-mount package. It features a drain-source voltage of 60 V and a continuous drain current of 43 A at 25 °C mounting base temperature. The device exhibits a maximum on-state resistance of 15 mΩ at VGS = 10 V and 25 °C. Total power dissipation reaches 62 W under specified conditions. It supports junction temperatures up to 175 °C and includes repetitive avalanche rating capabilities.
Verify the specific suffix 'EX' against official Nexperia documentation to confirm packaging details such as reel specifications or tape-and-reel dimensions. Ensure the component matches the LFPAK33 (SOT1210) outline drawing for PCB footprint compatibility. Confirm RoHS compliance status through the manufacturer's latest product change notification or datasheet revision history before finalizing procurement orders.
Select this component when designing circuits requiring a single N-channel switch with low conduction losses in a compact surface-mount form factor. The 15 mΩ RDS(on) minimizes heat generation during high-current operations. Verify that the gate drive voltage aligns with the standard level requirements for optimal performance. Consider the thermal resistance characteristics and available board space for the mounting base connection to ensure adequate heat dissipation within the 175 °C limit.
This part belongs to the Nexperia BUK7M series of standard level N-channel MOSFETs. These devices are engineered using TrenchMOS technology to deliver high current density and low on-resistance. The series is widely utilized in automotive and industrial sectors where reliability under thermal stress is critical. The LFPAK33 package provides a robust solution for power management applications requiring efficient thermal transfer from the junction to the mounting base.
BUK7M12-60EX
The maximum operating junction temperature is 175 °C.
Yes, the product has been designed and qualified to the AEC-Q101 standard for use in high-performance automotive applications.