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Product Detailed Parameters
- Description：MOSFET N-CH 40V 300A LFPAK88
- Series：-
- Mfr：Nexperia USA Inc.
- Package：Tape & Reel (TR),Cut Tape (CT)
- FET Type：N-Channel
- Technology：MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss)：40 V
- Current - Continuous Drain (Id) @ 25°C：300A (Tc)
- Drive Voltage (Max Rds On, Min Rds On)：10V
- Rds On (Max) @ Id, Vgs：1.2mOhm @ 25A, 10V
- Vgs(th) (Max) @ Id：3.6V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs：112 nC @ 10 V
- Vgs (Max)：+20V, -10V
- Input Capacitance (Ciss) (Max) @ Vds：8420 pF @ 25 V
- FET Feature：-
- Power Dissipation (Max)：294W (Tc)
- Operating Temperature：-55°C ~ 175°C (TJ)
- Grade：Automotive
- Qualification：AEC-Q101
- Mounting Type：Surface Mount
- Supplier Device Package：LFPAK88 (SOT1235)
- Package / Case：SOT-1235
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Overview
The Nexperia BUK7S1R2-40HJ is an automotive qualified N-channel MOSFET utilizing Trench 9 superjunction technology in a copper-clip LFPAK88 package. It features a drain-source voltage of 40 V, a continuous drain current of 300 A at 25 °C mounting base temperature, and a maximum total power dissipation of 294 W. The device exhibits a typical RDSon of 1.06 mΩ at VGS = 10 V and ID = 25 A (25 °C), with a junction-to-mounting base thermal resistance of 0.45 K/W. Operating temperatures range from -55 °C to +175 °C.
Feature Summary
- Fully automotive qualified to beyond AEC-Q101 standards for high reliability
- LFPAK88 copper clip package design enables improved power density and low thermal resistance
- Trench 9 superjunction technology provides reduced cell pitch and enhanced avalanche capability
- Gull wing leads facilitate visual AOI inspection and absorb mechanical stress
Applications
- 12 V automotive systems
- 48 V DC/DC systems on the 12 V secondary side
- Higher power motors, lamps and solenoid control
- Reverse polarity protection
- Ultra high performance power switching
Procurement Notes
Verify the specific ordering suffix 'J' against official Nexperia documentation to confirm packaging details, as datasheets may reference standard variants without this suffix. Confirm RoHS compliance and REACH status through the manufacturer's latest product specification sheets before finalizing procurement orders.
Selection Notes
Select this component for space-constrained high-power automotive applications requiring superior thermal efficiency compared to traditional wire bond packages. Ensure PCB thermal design supports the demonstrated 300 A continuous current capability, as practical limits depend on operating temperature and board layout.
Part Context
This part belongs to the Nexperia BUK7S series of standard level N-channel MOSFETs. It utilizes the LFPAK88 (SOT1235) plastic surface-mounted package variant designed specifically for automotive environments. The device represents an evolution in Trench 9 technology aimed at reducing conduction losses while maintaining robustness under demanding electrical conditions.
Replacement Considerations
Direct substitutes include other Nexperia BUK7S series devices within the same LFPAK88 footprint, such as the BUK7S1R4-40H or BUK7S084-40H, provided their electrical parameters meet the application requirements.
