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The BUK7Y3R5-40E is a standard level N-channel MOSFET utilizing TrenchMOS technology, housed in an LFPAK56 (Power SO8) package. It features a drain-source voltage of 40 V and a maximum continuous drain current of 100 A at a mounting base temperature of 25 °C. The device exhibits a typical on-state resistance of 3.5 mΩ at 25 °C and supports a total power dissipation of 167 W under specified conditions. It operates within a junction temperature range of -55 °C to +175 °C and includes repetitive avalanche rating capabilities.
Verify the specific ordering suffix against official Nexperia documentation to confirm packaging details such as reel or cut tape specifications. Ensure the component meets the required AEC-Q101 qualification status for your target application. Cross-reference the marking code '73E540' with the datasheet to authenticate the part number during incoming inspection.
Select this component when a standard level gate drive is required alongside high current handling in a compact surface-mount footprint. The LFPAK56 package offers improved thermal performance compared to traditional wire-bond packages. Consider the 175 °C junction temperature rating for designs operating in elevated ambient temperatures without excessive derating.
This device belongs to the Nexperia BUK7Y series of N-channel MOSFETs. It utilizes TrenchMOS technology to achieve low on-state resistance within the LFPAK56 package. The series is specifically engineered to meet automotive reliability standards while providing efficient power switching capabilities for 12 V systems.
Consult the Nexperia product selector tool for direct replacements with identical electrical characteristics and pinout configurations. Verify that any substitute component maintains the same AEC-Q101 qualification and LFPAK56 package dimensions to ensure mechanical compatibility.
The maximum junction temperature is 175 °C, allowing operation in thermally demanding environments.
Yes, the product has been designed and qualified to the AEC-Q101 standard for use in high-performance automotive applications.