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The BUK951R6-30E,127 is an N-channel TrenchMOS logic level field-effect transistor manufactured by Nexperia. It features a dual configuration within an LFPAK-56D-8 (SOT1205) surface-mount package. The device supports a drain-source voltage of 30 V and delivers a continuous drain current of 40 A. Its on-state resistance is specified at 3.9 mΩ per channel. The component operates with a gate-source voltage range of ±10 V and includes enhancement mode functionality. Thermal performance allows for power dissipation up to 64 W, with an extended operating temperature range from -55 °C to +175 °C.
Verify the specific ordering code suffix against manufacturer documentation to confirm exact packaging and tape-and-reel specifications. Confirm RoHS compliance status through official datasheets prior to integration. Ensure the LFPAK-56D-8 footprint matches PCB design requirements. Validate that the 30 V rating aligns with system voltage headroom needs. Check for any recent lifecycle notices regarding production availability.
Select this component when a dual N-channel MOSFET with logic-level compatibility is required in a space-constrained application. The 3.9 mΩ on-resistance offers efficiency benefits over higher resistance alternatives. Consider the 40 A current capacity for moderate power loads. The wide temperature range suits harsh environments. Compare against similar Nexperia BUK9 series devices if different pinouts or resistance values are needed.
This part belongs to the Nexperia BUK9 series of TrenchMOS logic level FETs. These devices utilize advanced trench technology to achieve low on-resistance and fast switching speeds. The series is designed for automotive and industrial applications requiring robust performance in compact packages. The LFPAK-56D-8 package provides superior thermal dissipation compared to standard SO packages.
Direct substitutes include other Nexperia dual N-channel MOSFETs in the LFPAK-56D-8 package with comparable Rds(on) and Vds ratings. Verify pinout compatibility before substitution. Alternative packages may require schematic and PCB redesign. Consult Nexperia's selection guide for cross-reference data.