BUK9J0R9-40HX

BUK9J0R9-40HX

$1.01
  • Description:BUK9J0R9-40H/SOT1023/4 LEADS
  • Series:-
  • Mfr:Nexperia USA Inc.
  • Package:Tape & Reel (TR)

SKU:7e5eb8072d86 Category: Brand:

  
  • Quantity
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Product Detailed Parameters

  • Description:BUK9J0R9-40H/SOT1023/4 LEADS
  • Series:-
  • Mfr:Nexperia USA Inc.
  • Package:Tape & Reel (TR)
  • FET Type:-
  • Technology:-
  • Drain to Source Voltage (Vdss):-
  • Current - Continuous Drain (Id) @ 25°C:220A (Tc)
  • Drive Voltage (Max Rds On, Min Rds On):-
  • Rds On (Max) @ Id, Vgs:-
  • Vgs(th) (Max) @ Id:-
  • Gate Charge (Qg) (Max) @ Vgs:-
  • Vgs (Max):+16V, -10V
  • Input Capacitance (Ciss) (Max) @ Vds:-
  • FET Feature:-
  • Power Dissipation (Max):-
  • Operating Temperature:-
  • Grade:Automotive
  • Qualification:AEC-Q101
  • Mounting Type:-
  • Supplier Device Package:-
  • Package / Case:-

Download product information

BUK9J0R9-40HX

Overview

The Nexperia BUK9J0R9-40HX is an automotive qualified N-channel MOSFET utilizing Trench 9 low ohmic superjunction technology within an enhanced LFPAK56E package. It features a drain-source voltage of 40 V and a typical on-state resistance of 0.82 mΩ at 25 °C. The device supports a continuous drain current of 220 A and total power dissipation of 500 W. Gate-source voltage limits are -10 V to 16 V, with a junction temperature range from -55 °C to 175 °C.

Feature Summary

  • Fully automotive qualified to AEC-Q101 standards for high performance and endurance in thermally demanding environments up to 175 °C.
  • Trench 9 Superjunction technology provides reduced cell pitch for enhanced power density, lower RDSon, improved SOA, and avalanche capability.
  • LFPAK Gull Wing leads offer high board level reliability by absorbing mechanical stress during thermal cycling compared to traditional QFN packages.
  • LFPAK copper clip technology improves reliability by reducing thermal resistance and on-state resistance while increasing maximum current capability.

Applications

  • 12 V automotive systems
  • Motors, lamps and solenoid control
  • Start-Stop micro-hybrid applications
  • Transmission control
  • Ultra high performance power switching

Procurement Notes

Verify the specific ordering suffix against official Nexperia documentation to confirm packaging details such as reel or cut tape configuration. Ensure the component matches the exact part number BUK9J0R9-40H for electrical specifications. Confirm RoHS compliance and REACH SVHC status through the manufacturer's latest product data sheet before integration into production designs.

Selection Notes

Select this component for applications requiring high current handling and low conduction losses in automotive environments. The logic level gate drive compatibility allows for efficient control with standard 4.5 V or 10 V drivers. Consider the LFPAK56E package for its superior thermal management and mechanical robustness in space-constrained PCB layouts.

Part Context

This device belongs to Nexperia's automotive-grade MOSFET portfolio designed for high-efficiency power switching. It leverages advanced superjunction technology to achieve industry-leading figures of merit within the LFPAK family. The part is engineered to meet stringent automotive reliability standards while providing compact form factors for modern vehicle electronics.

Replacement Considerations

Direct substitutes include other Nexperia parts in the BUK9J series with similar voltage and resistance ratings, such as BUK9J1R4-40H. Verify pinout compatibility and thermal characteristics when replacing components to ensure system performance remains within specified limits.

FAQ

What is the maximum junction temperature rating for this MOSFET?

The maximum junction temperature (Tj) rating is 175 °C, suitable for thermally demanding automotive environments.

Does this component support visual soldering inspection?

Yes, the LFPAK Gull Wing lead design allows for visual AOI soldering inspection without the need for expensive x-ray equipment.

What technology is used to achieve the low on-state resistance?

The device uses Trench 9 low ohmic superjunction technology, which reduces cell pitch to enhance power density and efficiency.

BUK9J0R9-40HXBUK9J0R9-40HX
$1.01
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