BUK9M24-80LX

$1.26

Description：BUK9M24-80L/SOT1210/MLFPAK
Series：-
Mfr：Nexperia USA Inc.
Package：Tape & Reel (TR),Cut Tape (CT)

SKU:697c33429d09 Category: Single FETs, MOSFETs Brand: Nexperia USA Inc.

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Product introduction

Product Detailed Parameters

Description：BUK9M24-80L/SOT1210/MLFPAK
Series：-
Mfr：Nexperia USA Inc.
Package：Tape & Reel (TR),Cut Tape (CT)
FET Type：N-Channel
Technology：MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss)：80 V
Current - Continuous Drain (Id) @ 25°C：35A (Ta)
Drive Voltage (Max Rds On, Min Rds On)：4.5V, 10V
Rds On (Max) @ Id, Vgs：23.6mOhm @ 10A, 10V
Vgs(th) (Max) @ Id：2.05V @ 60µA
Gate Charge (Qg) (Max) @ Vgs：28.4 nC @ 10 V
Vgs (Max)：±20V
Input Capacitance (Ciss) (Max) @ Vds：1810 pF @ 25 V
FET Feature：-
Power Dissipation (Max)：67W (Ta)
Operating Temperature：-55°C ~ 175°C (TJ)
Grade：Automotive
Qualification：AEC-Q101
Mounting Type：Surface Mount
Supplier Device Package：LFPAK33
Package / Case：SOT-1210, 8-LFPAK33 (5-Lead)

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BUK9M24-80LX

Overview

The BUK9M24-80L is an N-channel logic level MOSFET utilizing Trench12 technology, housed in an LFPAK33 (SOT1210) package. It features a drain-source voltage of 80 V and a continuous drain current of 35 A at 25 °C mounting base temperature. The device exhibits a maximum on-state resistance of 23.6 mΩ at VGS = 10 V and 25 °C. Total power dissipation reaches 67 W under specified conditions. The component is qualified to the AEC-Q101 standard for automotive applications operating up to 175 °C junction temperature.

Feature Summary

Logic-level compatible gate structure enabling efficient switching with soft body-diode recovery
Automotive qualification compliant with AEC-Q101 standards for high-performance environments
LFPAK33 package design incorporating side-wettable flanks to support robust solder joints and automatic optical inspection

Applications

12 V, 24 V and 48 V automotive systems
Motors, lamps and solenoid control
Transmission control
LED lighting
Circuit protection

Procurement Notes

Verify that the specific ordering suffix matches the required tape and reel configuration, as packaging variations exist within the product family. Confirm the revision status of the datasheet against the most recent Nexperia publication to ensure alignment with current electrical specifications and marking codes before finalizing procurement orders.

Selection Notes

Select this component when designing circuits requiring low on-state resistance at logic-level gate voltages within an 80 V system. The LFPAK33 package offers a compact footprint suitable for space-constrained PCB layouts while providing adequate thermal performance for automotive loads. Ensure the application operates within the specified 175 °C junction temperature limit to maintain reliability.

Part Context

This device belongs to Nexperia's BUK9M series of power MOSFETs designed for automotive and industrial markets. The series leverages Trench12 technology to achieve improved figure-of-merit characteristics compared to previous generations. The LFPAK33 package is part of Nexperia's broader portfolio of surface-mount solutions optimized for high-current density and thermal efficiency.