BUK9Y1R6-40HX

$0.62

Description：BUK9Y1R6-40H/SOT669/LFPAK
Series：-
Mfr：Nexperia USA Inc.
Package：Tape & Reel (TR)

SKU:decc8d3ed9e9 Category: Single FETs, MOSFETs Brand: Nexperia USA Inc.

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Product introduction

Product Detailed Parameters

Description：BUK9Y1R6-40H/SOT669/LFPAK
Series：-
Mfr：Nexperia USA Inc.
Package：Tape & Reel (TR)
FET Type：-
Technology：-
Drain to Source Voltage (Vdss)：-
Current - Continuous Drain (Id) @ 25°C：120A (Tc)
Drive Voltage (Max Rds On, Min Rds On)：-
Rds On (Max) @ Id, Vgs：-
Vgs(th) (Max) @ Id：-
Gate Charge (Qg) (Max) @ Vgs：-
Vgs (Max)：+16V, -10V
Input Capacitance (Ciss) (Max) @ Vds：-
FET Feature：-
Power Dissipation (Max)：294W (Tc)
Operating Temperature：-
Grade：Automotive
Qualification：AEC-Q101
Mounting Type：-
Supplier Device Package：-
Package / Case：-

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BUK9Y1R6-40HX

Overview

The Nexperia BUK9Y1R6-40HX is an N-channel logic level MOSFET utilizing Trench 9 superjunction technology, housed in a LFPAK56 (SOT669) package. It features a drain-source voltage of 40 V and a maximum continuous drain current of 120 A at 25 °C mounting base temperature. The device exhibits a typical on-state resistance of 1.23 mΩ at VGS = 10 V and ID = 25 A. Total gate charge is typically 77 nC. It supports junction temperatures up to 175 °C and total power dissipation of 294 W.

Feature Summary

Fully automotive qualified to AEC-Q101 standards for high performance and endurance.
Trench 9 Superjunction technology provides enhanced power density and improved safe operating area compared to standard TrenchMOS.
LFPAK Gull Wing leads absorb mechanical stress during thermal cycling and allow visual AOI soldering inspection.
LFPAK copper clip technology reduces thermal resistance and increases maximum current capability.

Applications

12 V automotive systems
Motors, lamps and solenoid control
Start-Stop micro-hybrid applications
Transmission control

Procurement Notes

Verify the specific ordering suffix matches the required tape and reel configuration. Confirm that the component meets AEC-Q101 qualification requirements for your target automotive application. Ensure the design accounts for the 175 °C junction temperature rating and appropriate PCB thermal management for the LFPAK56 package.

Selection Notes

Select this component for designs requiring low on-state resistance within a compact surface-mount footprint. The logic-level gate drive compatibility simplifies driver circuit design. Consider the tight threshold voltage limits if paralleling multiple devices is necessary for higher current handling.

Part Context

This part belongs to Nexperia's BUK9Y series of automotive-grade N-channel MOSFETs. It utilizes the LFPAK56 package, also known as Power-SO8, which integrates a copper clip for superior thermal performance. The series is designed for robust operation in thermally demanding environments.