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The BUZ31HXKSA1 is an N-channel enhancement mode power MOSFET manufactured by Infineon Technologies. It utilizes SIPMOS technology and is housed in a PG-TO220-3 (TO-220AB) flange mount package with three pins. The device features a drain-source breakdown voltage of 200 V and supports a continuous drain current of 14.5 A at case temperature. Its maximum drain-source on-resistance is specified at 0.2 Ω. The component is avalanche rated with an energy capability of 200 mJ. It operates within a temperature range from -55 °C to +150 °C, with a total power dissipation of 95 W at case temperature.
Verify the specific suffix HXKSA1 against official Infineon documentation to confirm exact manufacturing lot and compliance details. Ensure the ordering part number matches the required package variant and thermal characteristics. Confirm RoHS compliance status through the manufacturer's current product status reports before finalizing procurement specifications.
Select this component for designs requiring a 200 V N-channel MOSFET with moderate current handling capabilities. The TO-220-3 package facilitates effective heat dissipation for applications generating up to 95 W of power loss under controlled thermal conditions. Consider the 0.2 Ω on-resistance when calculating conduction losses in low-to-medium frequency switching environments.
This component belongs to the BUZ31 series of power transistors from Infineon Technologies. The series represents standard N-channel enhancement mode devices designed for general-purpose power switching. The BUZ31HXKSA1 variant specifically denotes the packaged version suitable for through-hole assembly, maintaining the electrical characteristics defined in the core BUZ31 datasheet.
Consult official Infineon replacement guides for verified cross-references. No public substitute part numbers are confirmed in the available data.