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The BYG24D-M3/TR is a fast avalanche surface-mount rectifier manufactured by Vishay General Semiconductor - Diodes Division. It features a glass passivated junction and operates in the SMA (DO-214AC) package. The device supports a maximum repetitive peak reverse voltage of 200 V, an average forward current of 1.5 A at 65 °C, and a peak forward surge current of 30 A. Electrical characteristics include a maximum instantaneous forward voltage of 1.25 V at 1.5 A, a maximum reverse current of 1 μA at 25 °C, and a maximum reverse recovery time of 140 ns. It withstands a non-repetitive pulse energy of 20 mJ in avalanche mode and functions within a junction temperature range of -55 to +150 °C.
Verify that the ordering suffix /TR corresponds to the 7-inch diameter plastic tape and reel delivery mode as specified in the manufacturer's preferred part number table. Confirm compliance requirements such as RoHS or halogen-free status based on the specific base part number variant selected. Ensure the application environment remains within the specified thermal resistance limits and operating temperature range.
Select this component when a single diode configuration with fast recovery and avalanche ruggedness is required in an SMA package. Consider the 200 V reverse voltage rating relative to circuit peak voltages. Evaluate thermal management needs against the junction-to-case and junction-to-ambient thermal resistance values provided in the datasheet for the specific mounting conditions.
This component belongs to the BYG24 series of fast avalanche SMD rectifiers from Vishay. The series includes variants with different reverse voltage ratings, specifically the BYG24G for 400 V and the BYG24J for 600 V. All variants share identical physical dimensions, current ratings, and package types, differing primarily in their breakdown voltage specifications.
Direct substitutes within the same family include BYG24G-M3/TR and BYG24J-M3/TR, provided the circuit voltage requirements align with their respective 400 V and 600 V ratings. Verify pinout compatibility and package dimensions when considering cross-manufacturer alternatives.