SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The CCB016M12GM3T is a six-pack Silicon Carbide (SiC) MOSFET module from the WolfPACK series, rated at 1200 V and 16 mΩ. It features press-fit pins for assembly and includes pre-applied phase change thermal interface material. The module supports a continuous drain current of 50 A at a heatsink temperature of 50 °C and operates within a virtual junction temperature range of -40 °C to 175 °C. Key electrical parameters include a gate-source voltage limit of -4 V to +15 V, an internal gate resistance of 2.35 Ω, and a junction-to-heatsink thermal resistance of 0.725 °C/W.
Verify the specific ordering suffix 'T' to confirm the inclusion of pre-applied phase change thermal interface material, distinguishing it from the non-pre-applied variant. Ensure compatibility with standard press-fit mounting tools and verify that the PCB layout accommodates the required DC+ external connection scheme. Confirm RoHS compliance status through official documentation prior to final procurement decisions.
Select this module for applications requiring high efficiency and compact system designs due to low parasitic inductance and fast switching capabilities. Evaluate the thermal management requirements against the specified junction-to-heatsink thermal resistance and maximum power dissipation limits. Consider the operating voltage and current ratings relative to the system's peak load conditions and ensure the gate drive circuitry supports the recommended ±15 V operational voltage.
This component belongs to the Wolfspeed WolfPACK product line, which utilizes industry-standard form factors to bridge the gap between discrete solutions and higher-power modules. The GM3 designation indicates third-generation SiC technology optimized for industrial applications. The six-pack topology allows for complex multi-phase configurations within a single compact package.
CCB016M12GM3 serves as the direct functional equivalent without pre-applied thermal interface material. Verify mechanical fit and thermal performance differences when substituting between these variants.
The CCB016M12GM3T includes pre-applied phase change thermal interface material, whereas the CCB016M12GM3 does not.
The DC+ pins must be connected externally at the PCB level.
No, the datasheet explicitly states that the device is not for use in linear region or linear mode.