CCS050M12CM2

Overview

The CCS050M12CM2 is a 1.2 kV, 50 A Silicon Carbide Six-Pack (Three Phase) module manufactured by Cree, Inc., now part of Wolfspeed. It integrates Z-FET™ MOSFETs and Z-Rec™ Diodes to deliver ultra-low loss performance with zero reverse recovery current and zero turn-off tail current. The device supports high-frequency operation and exhibits a positive temperature coefficient for both forward voltage and on-state resistance. Constructed with a copper baseplate and AlN DBC substrate, it enables compact, lightweight systems with reduced cooling requirements and ease of gate control.

Feature Summary

• Integrates Z-FET™ MOSFET and Z-Rec™ Diode technologies for ultra-low switching and conduction losses
• Features zero reverse recovery current and zero turn-off tail current for clean switching transitions
• Utilizes a copper baseplate with Aluminum Nitride Direct Bond Copper (AlN DBC) substrate for thermal management

Applications

• Solar Inverters
• Motor Drives
• 3-Phase PFC
• Regen Drives
• Induction Heating

Procurement Notes

Verify the manufacturer designation carefully, as the component datasheet identifies Cree, Inc. as the producer. Ensure compatibility with existing thermal interface materials due to the copper baseplate construction. Confirm that the three-phase six-pack configuration aligns with the specific inverter or converter topology requirements before integration into the design.

Selection Notes

Select this module for applications requiring high-efficiency three-phase power conversion at 1.2 kV blocking voltage. The 50 A rating suits moderate power density designs where reduced cooling complexity is beneficial. Consider the positive temperature coefficient for reliable parallel operation if higher current capacity is needed beyond the single module limit.

Part Context

This component belongs to the silicon carbide power module family, leveraging Wolfspeed's expertise in wide-bandgap semiconductors. It represents a transition from discrete SiC solutions to integrated modules, offering system-level benefits such as reduced parasitic inductance and simplified assembly compared to individual die implementations.

Replacement Considerations

Direct replacements must match the 1200 V / 50 A six-pack form factor. Verify pinout compatibility and thermal characteristics. Cross-reference with other Gen 3 or Gen 4 SiC modules from manufacturers like Micross Components or MacMic, ensuring equivalent Rds(on) and Vf specifications are met.