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The Microchip Technology CD1A30 is a Schottky barrier rectifier die designed for high-efficiency power rectification applications. It features a maximum reverse voltage of 30V and supports a forward current of 1A. The component exhibits a maximum forward voltage drop of 0.6V at 1A and a leakage current of 0.1mA. Packaged as a surface-mount die, it is suitable for compact circuit designs requiring reliable rectification with low conduction losses.
Verify the specific die configuration and handling requirements before integration. Confirm that the supplier provides authentic Microchip Technology components. Ensure compatibility with your assembly process for bare die or specialized packaging formats. Check for any specific storage conditions required to maintain device integrity prior to use in final products.
Select this component when a small form factor is critical due to its die packaging. Consider the 30V reverse voltage rating to ensure adequate margin for your circuit's peak inverse voltage. Evaluate the 0.6V forward voltage drop against thermal management capabilities, as lower drops reduce heat generation in high-current scenarios compared to standard PN junction diodes.
This part belongs to Microchip Technology's discrete semiconductor portfolio, specifically within the Schottky diode category. It represents a bare die solution rather than a packaged leaded component, targeting manufacturers integrating custom or highly miniaturized power management solutions into their printed circuit boards.
No public confirmed substitute part numbers are available in the provided documentation.