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The Bourns CD214C-B360R is a Schottky Barrier Rectifier Chip Diode designed for high-efficiency rectification in compact electronic systems. It features a maximum average forward current of 3 A and a maximum repetitive peak reverse voltage of 60 V. The device utilizes a low-profile SMC (DO-214AB) compatible package, ensuring minimal footprint and height savings on printed circuit boards. Electrical characteristics include a typical junction capacitance of 180 pF at 4 V reverse bias and a maximum instantaneous forward voltage of 0.7 V at 3 A forward current. Operating junction temperature ranges from -55 °C to +150 °C.
Verify the specific part number against the manufacturer's latest documentation to ensure compliance with current RoHS directives and environmental regulations. Confirm that the selected component meets the thermal management requirements of the target application, particularly regarding the operating junction temperature range and thermal resistance parameters under actual load conditions.
Select this component when a 60 V reverse voltage rating and 3 A continuous forward current are required within a DO-214AB form factor. Consider the typical junction capacitance and forward voltage drop for high-frequency switching applications. Ensure the PCB layout accommodates the recommended pad dimensions to maintain optimal thermal performance and mechanical stability during soldering processes.
This component belongs to the CD214C-B3xR series of Schottky Barrier Rectifier Chip Diodes manufactured by Bourns Inc. The series provides options for various reverse voltage ratings while maintaining a consistent 3 A forward current capability. These diodes address the industry demand for miniaturization in portable communications, computing, and video equipment by offering silicon diode functionality with minimal packaging overhead.
Cross-reference with other CD214C-B360R variants or equivalent SMC package Schottky diodes from different manufacturers if supply constraints exist. Verify that any substitute matches the 60 V reverse voltage, 3 A forward current, and physical package dimensions to ensure compatibility with existing PCB footprints and assembly processes.