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The CDBER00340 is a silicon Schottky barrier rectifier manufactured by Comchip Technology. It features a peak reverse voltage (Vrrm) of 40 V and an average forward current (Io) of 30 mA. The device utilizes a surface-mount SOD-723F package, also identified as 0503. Key electrical parameters include a maximum forward voltage drop of 370 mV at the rated current and a reverse leakage current of 1 µA. The component supports a forward surge current of 200 mA and operates within a junction temperature range of -55°C to +150°C.
Verify the specific suffix designation when ordering, as it may indicate packaging variations or environmental compliance status such as RoHS. Confirm the package type matches the design footprint requirements. Ensure the supplier provides valid datasheets and certification documents. Cross-reference the manufacturer part number with authorized distributor lists to guarantee authenticity. Check for any specific handling instructions related to electrostatic discharge sensitivity during storage and assembly.
Select this component for applications requiring low forward voltage drop and fast recovery times at low current levels. The 40 V rating suits low-voltage systems where higher voltage margins are unnecessary. The compact SOD-723F package is ideal for space-constrained PCB layouts. Consider thermal management requirements based on the expected forward current and ambient operating conditions. Evaluate reverse leakage current specifications if the application involves high-temperature operation.
This device belongs to Comchip Technology's discrete semiconductor product line, which specializes in surface-mount Schottky diodes and rectifiers. The company is recognized for standardized DFN and flat chip packaging solutions. This series complements other low-power rectification options in their portfolio, focusing on efficiency and miniaturization for modern consumer and industrial electronics.
Consult official substitution guides for compatible alternatives. Verify that any replacement maintains identical voltage, current, and package specifications. Ensure thermal and electrical performance metrics meet or exceed original requirements before implementation.