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CDSV6-4448AQ-G is listed in the Diode Arrays range at ChipApex. The manufacturer field lists Comchip Technology. Its product description is DIODE ARRAY GP 80V 500MA SOT-363. Review the specifications below when checking this part for your BOM.
The CDSV6-4448AQ-G is a general-purpose diode array manufactured by Comchip Technology. It features a common anode configuration with four individual diodes integrated into a single surface-mount package. The device supports a maximum repetitive peak reverse voltage of 80 V and provides a DC forward current rating of 500 mA per element. Key electrical characteristics include a fast reverse recovery time of 4 ns, ensuring efficient switching performance in high-speed applications. The component is housed in a compact 6-TSSOP (SOT-363) package, suitable for automated assembly processes.
Verify the specific ordering suffix AQ-G against official Comchip Technology documentation to confirm package type and compliance status. Ensure that the 6-TSSOP footprint matches the target PCB design. Cross-reference datasheet parameters such as thermal resistance and maximum junction temperature with system requirements before finalizing procurement decisions.
Select this component when a multi-diode solution with a shared anode is required for space-constrained designs. The 4 ns reverse recovery time makes it suitable for applications demanding rapid switching speeds. Consider the 500 mA current rating relative to the expected load to ensure adequate margin under operating conditions.
This part belongs to Comchip Technology's line of small-signal diode arrays designed for surface-mount technology. The SOT-363 package offers a compact form factor compared to through-hole alternatives, facilitating higher component density on printed circuit boards while maintaining reliable electrical performance for general electronic applications.
Consult official manufacturer substitution lists for verified equivalents. Generic replacements may differ in reverse recovery time or current handling capabilities. Verify pin compatibility and thermal characteristics before integrating alternative components into existing designs.
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