CDSV6-4448CD-G

Diode Arrays Overview

The CDSV6-4448CD-G is a dual switching diode manufactured by Comchip Technology, housed in an SOD-323 surface-mount package. It features a common cathode configuration with two independent internal diodes. The component supports a maximum repetitive peak reverse voltage of 75 V and a continuous forward current of 150 mA per element. Key electrical characteristics include a maximum reverse leakage current of 1 µA at rated voltage and a typical forward voltage drop of 1.25 V at the specified current. The device operates within a temperature range of -55 °C to +150 °C.

Diode Arrays Feature Summary

• Dual single-diode structure integrated into a compact surface-mount footprint
• Common cathode pinout arrangement for simplified circuit routing
• High-speed switching capability suitable for signal processing applications

Diode Arrays Applications

• Signal rectification in low-power electronic circuits
• Protection against reverse polarity in sensitive input stages
• Clamping and steering functions in communication interfaces

Diode Arrays Procurement Notes

Verify the specific suffix CD-G against official Comchip Technology documentation to confirm the exact packaging type and tape-and-reel specifications. Ensure that the requested quantity aligns with the manufacturer's standard reel sizes or cut-tape availability. Cross-reference the RoHS compliance status directly with the latest datasheet to meet environmental regulatory requirements for your assembly process.

Diode Arrays Selection Notes

Select this component when a dual diode solution is required in a minimal space-constrained design. The common cathode configuration simplifies layout compared to discrete components. Verify that the 75 V reverse voltage rating exceeds the peak inverse voltage present in the target application. Confirm that the 150 mA forward current capacity meets the load requirements for both channels simultaneously.

Diode Arrays Part Context

This part belongs to the CDSV series of small-signal switching diodes from Comchip Technology. These devices are designed for general-purpose high-speed switching applications. The series utilizes silicon epitaxial planar technology to ensure reliable performance under varying thermal conditions. The SOD-323 package provides a balance between thermal dissipation and board space efficiency.

Diode Arrays Replacement Considerations

Consult official cross-reference lists for verified substitutes. Generic equivalents may differ in reverse leakage current or switching speed. Validate any alternative part number against the original datasheet parameters before implementation.