SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The CM300HA-12H is a single IGBTMOD™ H-Series power module manufactured by Powerex Inc., rated for 300 Amperes and 600 Volts. It integrates one IGBT transistor with a reverse-connected super-fast recovery free-wheel diode in a flange-mount package. Key electrical parameters include a collector-emitter saturation voltage of 2.1V typical at 300A, a gate threshold voltage range of 4.5V to 7.5V, and a total gate charge of 900nC. The device supports junction temperatures up to 150°C, offers 2500Vrms isolation, and features thermal resistance from junction to case of 0.11°C/W for the IGBT and 0.24°C/W for the diode.
Verify component authenticity through authorized Powerex distributors or direct manufacturer channels. Confirm that the received unit matches the CM300HA-12H designation and packaging specifications. Check for physical damage to the flange mount terminals and ensure proper handling procedures are followed to maintain the integrity of the isolated baseplate and internal semiconductor structures.
Select this module for high-frequency switching applications operating between 20kHz and 25kHz. Ensure the cooling solution can manage the specified thermal resistance values and that the gate drive circuit provides the required ±15V supply. Verify that the peak collector current capability of 600A aligns with the system's transient load requirements without exceeding junction temperature limits.
This component belongs to the IGBTMOD™ H-Series line of intelligent power modules designed for robust switching applications. It represents a hybrid technology approach combining discrete components within a single insulated package. The series is engineered to provide simplified thermal management and reliable performance in industrial power conversion environments requiring high current density.
Publicly confirmed substitute part numbers are not available in the provided documentation. When evaluating alternatives, verify compatibility with the 600V/300A rating, flange-mount mechanical dimensions, and thermal interface requirements to ensure seamless integration into existing designs.