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CME7660-000 is listed in the RF Diode range at ChipApex. The manufacturer field lists Skyworks Solutions Inc.. Its product description is RF DIODE SCHOTTKY 2V 75MW DIE. Review the specifications below when checking this part for your BOM.
The CME7660-000 is an N-type silicon Schottky barrier diode chip designed for Ku-band applications up to 40 GHz. It features a medium barrier design with a maximum reverse voltage of 2 V and a forward current rating of 100 mA. The device exhibits a capacitance (CJ) of 0.15 pF at 0 V, a forward voltage (VF) of 350–450 mV at 1 mA, and a slope resistance (RT) of 10 Ω at 10 mA. Operating temperature ranges from -55°C to +150°C, with storage limits between -60°C and +200°C.
Verify the specific ordering suffix against the manufacturer's official documentation to confirm exact electrical tolerances and packaging type. Confirm availability status as distribution channels may list obsolete or discontinued inventory. Ensure handling procedures comply with industry-standard ESD precautions to prevent device degradation prior to installation.
Select this component when designing Ku-band systems requiring N-type material characteristics for biased detection or low-loss mixing. Compare the 0.15 pF capacitance and 350–450 mV forward voltage against system impedance requirements. Evaluate the suitability of the universal chip format for custom substrate mounting versus pre-packaged beam-lead alternatives.
This part belongs to Skyworks' Silicon Schottky Barrier Diode Bondable Chips and Beam Leads family. It shares the general planar passivation and beam-lead architecture found in the DDB, CDB, and CDF series, but utilizes N-type silicon specifically for different noise and bias performance profiles compared to the P-type variants.
Direct functional substitutes within the same datasheet include other Ku-band N-type chips such as the CDP7624-000. Designers should verify that the alternative part's capacitance and forward voltage parameters align with the existing circuit impedance matching network.
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