CMKSH-3T TR PBFREE

Diode Arrays Overview

The Central Semiconductor CMKSH-3T is a surface mount silicon triple isolated Schottky diode housed in an SOT-363 package. It contains three independent diodes designed for switching applications requiring low forward voltage drop. Key electrical parameters include a peak repetitive reverse voltage of 30 V, continuous forward current of 100 mA, and power dissipation of 350 mW at 25°C ambient temperature. The device operates within a junction temperature range of -65 to +150 °C.

Diode Arrays Feature Summary

• Contains three electrically isolated silicon Schottky diodes within a single surface mount package
• Designed for fast switching applications with low forward voltage drop characteristics
• Features a compact SOT-363 (R5) mechanical outline for space-constrained designs

Diode Arrays Applications

• Fast switching circuits requiring multiple isolated diode functions
• Low forward voltage drop signal processing applications
• Surface mount assembly for compact electronic devices

Diode Arrays Procurement Notes

Verify the specific ordering suffix against manufacturer documentation to confirm plating options. The PBFREE designation indicates lead-free compliance. Confirm the SOT-363 package type and marking code KHT match design requirements. Ensure thermal resistance and power dissipation limits are considered for the intended operating environment.

Diode Arrays Selection Notes

Select this component when multiple isolated Schottky diodes are required in a minimal footprint. The SOT-363 package accommodates three distinct channels. Evaluate the 30 V reverse voltage and 100 mA forward current ratings against circuit demands. Consider the 357 °C/W thermal resistance for heat management in dense layouts.

Diode Arrays Part Context

This part belongs to Central Semiconductor's Super-Mini Schottky Diode series, which focuses on surface mount technologies for high-speed switching. The triple isolated configuration distinguishes it from standard dual or single-channel variants, offering greater design flexibility for complex isolation needs within a small form factor.

Diode Arrays Replacement Considerations

Cross-reference pin configurations carefully, as the SOT-363 layout assigns specific anodes and cathodes to pins 1 through 6. Verify that substitute components maintain the same isolation between diodes and compatible forward voltage specifications.