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Product Detailed Parameters
- Description：JFET N-CH SWITCH CHOPPER
- Series：*
- Mfr：Central Semiconductor Corp
- Package：Tray
- FET Type：-
- Voltage - Breakdown (V(BR)GSS)：-
- Drain to Source Voltage (Vdss)：-
- Current - Drain (Idss) @ Vds (Vgs=0)：-
- Current Drain (Id) - Max：-
- Voltage - Cutoff (VGS off) @ Id：-
- Input Capacitance (Ciss) (Max) @ Vds：-
- Resistance - RDS(On)：-
- Power - Max：-
- Operating Temperature：-
- Mounting Type：-
- Package / Case：-
- Supplier Device Package：-
- Grade：-
- Qualification：-
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Overview
The CP206-2N4392-CM is a silicon N-channel small signal Junction Field-Effect Transistor (JFET) supplied as a bare die. It features a 21 x 18 mils die size with gold backside metalization and aluminum top side metallization. The device is designed for analog switching and chopper applications, operating within a junction temperature range of -65 to +175 °C. Key electrical parameters include a maximum gate-drain voltage of 40 V, an on-resistance of 60 Ω at 1 mA drain current, and a feedback capacitance of 3.5 pF. The 'CM' suffix indicates the die is singulated and packed in a waffle tray after 100% visual inspection per MIL-STD-750.
Feature Summary
- Silicon N-channel JFET structure optimized for low leakage and high-speed analog switching
- Gold backside metallization for reliable thermal dissipation and bonding
- Singulated bare die configuration suitable for custom packaging or hybrid circuits
- Visual inspection compliance with MIL-STD-750 standards
Applications
- Analog signal switching circuits
- Chopper stabilization amplifiers
- High-voltage input stages
- Custom hybrid microelectronics
Procurement Notes
This component is classified as End of Life under the CP206 wafer process. Procurement is restricted to existing stock only; no new production orders are accepted. Buyers should verify available inventory levels directly with Central Semiconductor representatives before finalizing acquisition plans.
Selection Notes
Select this part when a discrete N-channel JFET die is required for custom assembly rather than standard packaged transistors. Verify that the application supports bare die handling and wire bonding processes. Ensure the design accommodates the specific die dimensions and metallization requirements provided in the mechanical specifications.
Part Context
Central Semiconductor manufactures this device using the CP206 wafer process, which has been discontinued. The manufacturer provides a transition path to the CP216 process technology. This product serves as a raw semiconductor component intended for integration into larger systems or specialized packages by the end user.
Replacement Considerations
The official replacement for the CP206-2N4392-CM is the CP216-2N4392-CM. Designers should request updated datasheets for the CP216 series to confirm if any parameter shifts affect the specific application requirements before substituting the legacy part.
