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CP307-MPSA27-WN is listed in the Single Bipolar Transistors range at ChipApex. The manufacturer field lists Central Semiconductor Corp. Its product description is TRANS NPN DARL 60V 0.5A DIE. Review the specifications below when checking this part for your BOM.
The CP307-MPSA27-WN is a bare NPN silicon Darlington transistor die manufactured using the Central Semiconductor CP307 epitaxial planar process. It features a die size of 27 x 27 mils and a thickness of 9.0 mils, with aluminum top-side metalization and gold back-side collector metallization. The component is supplied as an unsawn full wafer (WN suffix), where every die is electrically tested and rejected units are inked. This specific part number has been officially classified as End of Life.
This component is officially discontinued and classified as End of Life. Procurement is restricted to remaining inventory or last-time buys subject to availability. Verify current stock status directly with the manufacturer or authorized distributors before design finalization. Replacement options exist within the updated CP327V process family.
Select this component only if the specific CP307 epitaxial planar characteristics and physical dimensions meet the design requirements. Engineers must account for the discontinuation status when planning long-term production. Evaluate the CP327V process family as the designated replacement technology for new designs requiring similar electrical performance profiles.
The CP307 process represents a legacy manufacturing line for small signal transistors at Central Semiconductor Corp. The MPSA27 designation indicates a standard NPN Darlington configuration adapted for bare die applications. The WN suffix specifically denotes the unsawn wafer format, distinguishing it from singulated tray packages like CT or CM.
Officially documented replacements include CP327V-MPSA27-CT and CP327V-MPSA27-WN. These parts utilize the newer CP327V wafer process while maintaining the MPSA27 functional specification.
The 'WN' suffix indicates that the device is supplied as a full, unsawn wafer. All dies are electrically tested, and any rejected units are marked with ink.
No, the CP307 wafer process is discontinued. The product is classified as End of Life (EOL).
Central Semiconductor identifies the CP327V process family as the replacement. Specific equivalents include CP327V-MPSA27-CT and CP327V-MPSA27-WN.
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