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The CSD13302WT is a single N-channel NexFET power MOSFET manufactured by Texas Instruments. It utilizes silicon technology and is housed in a DSBGA-4 surface-mount package. The device features a drain-source breakdown voltage of 12 V and supports a continuous drain current of 1.6 A. Its on-resistance is specified at 17.1 mOhms, with a gate threshold voltage of 700 mV. Key switching parameters include a total gate charge of 7.8 nC and rise/fall times of 7 ns. The component operates within a temperature range of -55°C to +150°C and has a power dissipation rating of 1.8 W.
Verify the specific ordering suffix 'WT' against official Texas Instruments documentation to confirm reel packaging specifications. Ensure compatibility with standard SMD/SMT assembly processes. Confirm RoHS compliance status through the manufacturer's datasheet before procurement. Validate that the DSBGA-4 footprint matches the target PCB design requirements.
Select this component for low-voltage applications requiring efficient switching with minimal conduction losses. The 12 V rating suits battery-powered or low-voltage DC systems. Consider the small DSBGA-4 package for space-constrained designs. Evaluate thermal management needs based on the 1.8 W power dissipation limit and operating environment.
This part belongs to the CSD13302W series of NexFET power MOSFETs from Texas Instruments. These devices are engineered for high efficiency in power conversion tasks. The series focuses on reducing on-resistance while maintaining robust switching characteristics suitable for modern electronic equipment.
Consult official substitution guides for compatible alternatives. Verify pinout and electrical parameter alignment before replacing.