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The CSD16342Q5A is a 25V N-Channel NexFET™ Power MOSFET designed for low-loss power conversion. It features an 8-pin VSONP (DQJ) package measuring 5mm x 6mm. Key electrical parameters include a maximum drain-source voltage of 25V, continuous drain current of 21A at ambient temperature and 100A at case temperature, and a pulsed drain current of 131A. The on-resistance is rated at 7.8mΩ max at VGS=2.5V, 5.5mΩ max at VGS=4.5V, and 4.7mΩ max at VGS=8V. Total gate charge is 7.1nC max at 4.5V. Thermal resistance is 50°C/W junction-to-ambient and 1.2°C/W junction-to-case.
Verify the active production status and RoHS compliance before procurement. Confirm the specific ordering suffix matches the required tape and reel quantity of 2500 units. Ensure the design accommodates the VSONP DQJ package dimensions and thermal pad requirements for proper heat dissipation.
Select this component for applications requiring efficient 5V logic-level gate drive control. The low RDS(on) at VGS=2.5V makes it suitable for battery-powered or low-voltage control circuits. Consider the thermal resistance values when designing PCB copper areas to ensure operation within the -55°C to 150°C junction temperature range.
This device belongs to Texas Instruments' NexFET™ family of power MOSFETs. It is part of the CSD16342 series, specifically the Q5A variant housed in an 8-pin VSONP package. The product is classified as production data, indicating full qualification and availability for general manufacturing use.
Check for direct pin-compatible alternatives within the CSD16342 series or other TI NexFET devices with matching 25V ratings and similar RDS(on) specifications. Verify that any substitute maintains the same VSONP 5x6mm footprint and thermal characteristics.
The device is rated for 80 mJ of single-pulse avalanche energy when tested with ID = 40A, L = 0.1mH, and RG = 25Ω.
RDS(on) decreases as gate voltage increases: it is 7.8mΩ max at VGS=2.5V, 5.5mΩ max at VGS=4.5V, and 4.7mΩ max at VGS=8V.