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The CSD19536KCS is a single N-channel NexFET power MOSFET manufactured by Texas Instruments. It utilizes silicon technology and is housed in a TO-220-3 through-hole package. The device features a drain-source breakdown voltage (Vds) of 100 V and supports a continuous drain current (Id) of 259 A. Its maximum on-resistance (Rds On) is 2.7 mΩ, with a gate threshold voltage (Vgs th) of 2.1 V. Total gate charge (Qg) is 118 nC. Power dissipation reaches 375 W, operating within a temperature range of -55°C to +175°C.
Verify the specific suffix KCS confirms the TO-220-3 through-hole package variant. Confirm RoHS compliance status via official documentation before integration. Ensure thermal management solutions align with the 375 W power dissipation rating at case temperature. Validate that the 100 V rating meets circuit requirements.
Select this component when a through-hole N-channel MOSFET with 100 V rating and low on-resistance is required. Compare against surface-mount alternatives like the CSD19536KTT if PCB space constraints exist. Consider the 259 A current capacity for heavy-load designs. Verify gate drive compatibility with the 2.1 V threshold voltage.
This part belongs to the CSD19536 series of NexFET power MOSFETs from Texas Instruments. The series includes variants with different packaging options, such as the TO-263 DDPAK-3 for surface mount applications. All variants share similar electrical characteristics optimized for high-density power conversion.
The CSD19536KTT serves as a surface-mount equivalent within the same family. Verify pinout compatibility and thermal performance differences between TO-220-3 and TO-263 packages when substituting.