CSD87331Q3D

Overview

The CSD87331Q3D is a 30-V Synchronous Buck NexFET Power Block manufactured by Texas Instruments. It integrates high-side and low-side N-channel MOSFETs with a gate driver in an 8-LSON package (HTSON, 3.3 mm length). The device supports a minimum input voltage of 12 V and a nominal input voltage of 27 V. It operates within a temperature range of -55°C to +150°C. The component is lead-free, RoHS compliant, and classified as a switching controller under ECCN EAR99. It features a single functional unit with eight terminals, adhering to JESD-30 code S-PDSO-N8 and JESD-609 code e4 standards.

Feature Summary

• Integrates synchronous buck power stage and control logic into a compact form factor
• Utilizes NexFET technology for optimized power efficiency
• Designed for high-temperature operation up to 150°C

Applications

• Synchronous buck converter circuits
• Point-of-load regulation modules
• Embedded power management systems

Procurement Notes

Verify the specific ordering suffix and package variant when sourcing, as designations like G4 indicate environmental compliance variations. Confirm availability through authorized Texas Instruments distributors or direct channels. Ensure the procurement source provides valid datasheets matching the exact part number to avoid counterfeit components. Check for moisture sensitivity level 1 handling requirements during storage and assembly processes.

Selection Notes

Select this component for applications requiring a compact synchronous buck solution with integrated gate drive. The 30-V rating suits systems operating around 12-V or 24-V nominal rails. Consider the 8-LSON package constraints for thermal management and PCB layout. Verify that the input voltage range aligns with the system's minimum and nominal supply requirements before integration.

Part Context

This part belongs to the Texas Instruments NexFET Power Block family, which combines power switches and drivers. It differs from discrete MOSFETs by integrating control logic, reducing external component count. The Q3D suffix typically denotes a specific package and thermal configuration within the series. It serves as a building block for efficient DC-DC conversion in space-constrained designs.

Replacement Considerations

Direct substitutes include other TI NexFET Power Blocks with similar voltage ratings and pinouts, such as the CSD87333Q3D. Verify compatibility regarding package dimensions, thermal characteristics, and electrical parameters before substitution. Cross-referencing with official TI replacement guides ensures functional equivalence.